Diamond wire manufacturer for multi wire saw

Price: 0.1~0.2 USD
Trade Term: FOB
Payment Terms: T/T,WU
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Basic Info.
  • Place of Origin: Jiangsu  
  • Min.Order: 50 Kilometer
  • Means of Transport: Air
Supply Capacity
  • Production Capacity: 30000
  • Delivery Date: 10

Homray as the leading manufacturer and supplier of good quality diamond cutting wire, double side lapping carrier, epoxy resin working carrier, blue steel lapping carrier and ceramic block for wafer bonding, resin copper polishing plate, casting iron lapping plate ,diamond edge grinding wheel, back side grinding wheel and ceramic conditioning ring etc. Our diamond cutting wire, resin lapping carrier and other consumables are widely used in various Multi Wire Saw Machine, Double Side Lapping Machine, DMP Machine (Cu Polishing Machine) for LED sapphire substrate wafer polishing, lapping process and LED EPI wafer thinning process. 

Excellent tension control and yield strength

50% faster than conventional cutting process

High precision and good surface performance

Precise control for wire diameter, uniform wire shape 

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Ms. Tina Chang
Tel: 86-512-67084276
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Contact Method
Homray Material Technology Co., Ltd
LiSheng Industrial Building ,60 SuLi Road, Soochow, Suzhou, Jiangsu, China (Mainland)
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