PC Reflector for 100w Philips Cree Led High Bay Lights , LE D Stadium Light
Quick Detail:
- Cree leds,Meanwell driver
- Fins Cooling Design For 1070 Aluminum Alloy
- Based On Crees sc3 Technology Planform
- Using Dlc Technology For Mpcb
-
Ra>75
-
UL,CUL,DLC,SAA.FCC,CE Approval
Product description:
- CREE Second Generation XMLB LED, high luminous efficiency and long life.
- MEAN WELL High efficiency LED Driver, the wide range input voltage AC200-480V
- Heat pipe with fins cooling design, better cooling, light quality, LED Tj < 85.
- Excellent lampshade design, greatly improve the light utilization and evenness.
Structure Features:
- Shell materials: Heat pipe and cooling fins for 1070 aluminum alloy.
- Color: Silver white (Electrolytic shading)
- Net weight: 5.50Kg
- Unit: mm
Applications:
UL LED High Bay Lighting series can be widely used in outdoor, indoor or outdoor lighting(Wet location), like mechanical or electronic processing workshops, storage warehouses, steel mills, gas stations, toll booth, waiting rooms, the platforms of railway station , indoor stadiums and flower cultivating tents etc.
Specifications:
| Type | UL-HB10W27-xxK | ||
| Power | 100W | Lighting Angle | 45°/90°/120° |
| Input Voltage | AC110-277V | LED Brightness Decay | <5%/6000 hrs |
| PF | >0.95 | Working Life | >50000 hrs |
| Driver Efficiency | >90% | Working Temperature | -30 - +40 |
| Luminous Flux | 9950 Lm | Storage Temperature | -40 -+80 |
| Color Temperature | 3000K/4000k/5000K/6500k | Protection Level | Wet Location/IP65 |
| CRI | Ra>75 | Cable | 3 core,18AWG(1.5m) |
Competitive Advantages:
1, BASED ON CREES SC3 TECHNOLOGY PLANFORM
Using XMLB LED of CREE Inc,Based on Cree’s SC3 technology platform,High efficiency and high reliability.
2, TESTING BY X-RAY
LED soft soldering testing by X-RAY for cold solder joint and soldering related non-conforming.
3,COPPER SUBSTRATE
Heat conductivity coefficient of copper substrate is 383.8W/m.K,but the traditional aluminum substrate is about 2.0-3.0W/m.K.
4,USING DLC TECHNOLOGY FOR MPCB
Using DLC technology for MPCB module,heat conduction rate at 200W/m.K,lower junction temperature.
5,USING METAL POWDER ADHESIVE
Using high conduction adhesives 30W/m.K,not the heat conductive silicone grease,it’s metal powder adhesive.
6,USING HEAT PIPE AND COOLING FINS FOR 1070 ALUMINUM ALLOY
Using heat pipe and cooling fins for 1070 aluminum alloy,fast conduction.
7,24 HOURS HIGH TEMPERATURE TESTING
High temperature testing room at 106,24 hours aging after aging.
30 minutes switch aging(10 seconds per cycle)
