BGA Rework Station YIHUA853AAA Preheating station +hot air rework +soldering iron station
Feature
1.Using microcomputer processor PID programmable temperature control technologyPreheating station is to use a glaze layer having a high thermal effect, good thermal shock resistance of the ceramic as the substrate, high-quality nickel branded alloy wire once sintering. It has a high thermal effect, overall good, good thermal stability, uniform heating, high dielectric strength, clean, easy to install and so on features.
2.Air Gun heater use ceramic heater, heating elements firmly wrapped around the model ceramic, rapid and uniform heating. Use the upgraded version fan, the airflow larger than the ordinary fan, spiral out of the wind, long life.
3.Soldering iron part using Hakko heater, heating up rapidly, temperature stability, long service life; antistatic design to prevent electrostatic damage to delicate SMD components.
4.The machine has a self-test function, full intelligent over-temperature, short-circuit, open circuit, overload and fault display and protection functions.
5.853AAA preheating station using the user-friendly design, the cover affixed with a high-temperature, insulated protection pads to prevent scalding operation. The stent uses magnetic induction technology, card board bracket to prevent protective pads suck hood above, can rotate 360 degrees, flexible card board, it is suitable for the circuit boards of different shapes and sizes.
6.853AAA temperature correction function: to adapt to the environmental impact, or replace the heating elements, soldering iron tips etc. spare parts caused by temperature deviation, can use this function calibration temperature. The correction temperature range is -50 °C ~ +50 °C.
7.853AAA has Celsius / Fahrenheit temperature display function: meet different market needs to design the temperature display mode, you can choose under customary interest.
General Usage
1). Suitable for de-soldering and soldering BGA, SOIC, CHIP, QFP, PLCC package SMD IC,
Particularly suitable for de-soldering BGA module, computer motherboard north and south bridge, all kinds of mobile phone motherboard SMT IC and LED lights.
2). Shrinking, Paint drying, adhesive removal, thawing, warming, Plastic welding etc.
Data:
Voltage: AC220C±5%
Max power consumption: 1270W
Preheating station parts:
Temperature Range: 50~ 300 °c or 50~400 °c /152~572 °F or 152~752 °F
Temperature Stability: ±2 °c
Display Type: LED
Area: 120*120mm
Hot Air Reworks parts
Airflow type: brushless fan spiral out wind
Air Flow:≤130L/min
Temperature Range: 100 °c -480 °c /212°F ~896 °F
