Specifications:
Layers: 1 to 48
Board finished thickness: 0.21 to 7.0mm
Materials: FR-4, CEM-1, CEM-3, high TG, FR4 halogen free,Rogers
Maximum finished board size: 23 x 25mm (580 x 900mm)
Minimum drilled hole size: 3 mils (0.075mm)
Minimum line width: 3 mils (0.075mm)
Minimum line spacing: 3 mils (0.075mm)
Size: 243.4 x 244.43mm
Surface finishing/treatment: HASL/HASL lead-free, HAL, chemicaltin, chemical gold,
immersion silver/gold, OSP, gold plating
Copper thickness: 0.5 to 7.0oz
Solder mask colors: green, yellow, black, white, red, blue
Copper thickness in hole: >25.0µm (>1 mil)
Packing:
Inner packing: vacuum packing/plastic bag
Outer packing: standard carton packing
Shape tolerance: ±0.13
Hole tolerance:
PTH: ±0.076
NPTH: ±0.05
With UL, SGS and RoHS marks
Special requirements: buried and blind via + controlledimpedance + BGA
Profiling: punching, routing, V-cut, beveling
Testing procedure:
Visual inspection
Flying probe
Impedance control
Solder-ability detection
Digital metallographic microscope
AOI (automated optical inspection)
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Services:
No MOQ
Provide OEM services
Multilayer PCB sample: 6-10 days, mass production: within 15 days
Double-sided PCB sample: 3-5 days, mass production: within10 days
Shipping methods: DHL, UPS, FedEx, TNT forwarder
