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10 Layer FR4 3.0mm Plating Gold Impedance Control Quick Turn PCB Prototypes HDI PCB
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10 Layer FR4 3.0mm Plating Gold Impedance Control Quick Turn PCB Prototypes HDI PCB

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10 Layer FR4 3.0mm Plating Gold Impedance Control Quick Turn PCB Prototypes HDI PCB

 

 

Product Description

Model Number:

CTE-008

Number of Layer: 

10layer

Material:

FR4 Tg170

Finish  Thickness:

3.0mm

Finish  copper: 

2OZ

Surface Finish:

Plating gold

 

Green solder mask

 

White silkscreen

 

CNC routing V-CUT

Place of Origin:

China

Brand Name:

CHITUN

Certification:

UL,ROHS,ISO

Standard:

IPC  or base on customers' requestion

 

24Hours for urgent 1-2layers ,   

2-4days for multilayer PCBs .

24 hour turnaround time on double-sided PCB’s, 
2-4 day turn available up to ten layers;

over ten layers can be done in one week. 

To shorten the cycle time of new product introduction.

 

 

Applications(Target Market):

 

Cooling and Washing machine, Switching Power Amplifiers, Home Computer, Home Theater/Stereo Surround Sound System, Cable Television Converter Box, Hand Held Video Games, Digital and analog Switching, Remote control electronic toys, Disk Drive duplication systems, LOJACK auto recovery system, Electronic Television Audience Measurement Systems/Electronic Audience Measurement Systems,Headphone Systems ect.

 

 

Technology Capability

Feature

2015

2016

2017

Base Material 

CEM1,CEM3,
Middle-Tg FR4,
High-Tg FR4,
Halogen free,
BT / Rogers / PTFE

Aluminum base material

CEM1,CEM3,
Middle-Tg FR4,
High-Tg FR4,
Halogen free,
BT / Rogers / PTFE

Aluminum base material

CEM1,CEM3,
Middle-Tg FR4,
High-Tg FR4,
Halogen free,
BT / Rogers / PTFE

Aluminum base material

Max. Layer Count 

24

30

32

Max. PCB Size (max.) 

558mm X 660mm

558mm X 660mm

558mm X 660mm

Base copper 

1/3 oz - - 5 oz 

1/3 - - 5 oz 

1/3 - - 5 oz 

Copper thickness (outer) 

6 oz

6 oz 

6 oz 

Max. Board Thickness mm 

(mil) 

3.4 (134) 

3.4 (134) 

3.4 (134) 

Min. Board Thickness mm 

(mil) 

0.1 (4)

0.1 (4)

0.1 (4)

Min. Line Width 

/ Spacing 

Inner um 

(mil)

75/100 (3 4)

75/75 (3/3) 

75/75 (3/3) 

Outer um 

(mil)

100/100 (4/4) 

75/75 (3/3) 

75/75 (3/3) 

Min. Mechanical Drill Size 

(mm) 

0.2

0.2

0.2

Min. HWTC um (mil) 

175 (7) 

175 (7) 

175 (7) 

Min. Soldermask 

Opening um 

(mil) 

50 (2) 

50 (2) 

50 (2) 

Finest SMT Pitch mm 

(mil) 

0.40 (16) 

0.45 (18) 

0.45 (18) 

BGA Device Pitch 

(Base Copper 1oz)

 (mil) 

0.25-0.3 (10-12) 

0.25-0.3 (10-12) 

0.25-0.3 (10-12) 

Type of Surface Finish 

HASL, lead free HASL, 

ENIG, Flash gold, 

Thick gold, 

Selective gold plating, 

OSP, 

Selective OSP /HASL, 

Immersion Tin, 

Immersion Silver

HASL, lead free HASL, 

ENIG, Flash gold,

Thick gold, 

Selective gold plating, 

OSP, 

Selective OSP /HASL, 

Immersion Tin, 

Immersion Silver

HASL, lead free&nb

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Mr. Zhang
Tel: 86-755-29639796
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Contact Method
Chi Tun Electronics Company
FLAT2413 HANG CHI HOUSE CHEUNG HANG ESTATE TSINGYI TSUENWAN Hongkong, Shenzhen, Guangdong, China (Mainland)
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