Cup Head Hole Metal Core PCB Single sided Counterbore for Spotlight
Key Specifications/Special Features
| Number. of Layers: | 1 |
| Laminate Material: | Copper |
| Surface Finish: | OSP |
| Copper Thickness: | 2 oz |
| Board Thickness: | 2.0mm (0.078”) |
| Board Size: | |
| Color of Mask: | White |
| Color of Silkscreen: | - |
| Flammability: | UL 94V-0 |
| Workmanship: | Compliance with IPC-A-600 & IPC-6012 CLASS II |
| Thermal Conductivity | - |
Single Layer Metal Core PCB
A simple layer single sided MCPCB consists of a metal base (usually aluminum, or copper alloy), Dielectric (non-conducting) Layer, Copper Circuit Layer, IC components and solder mask.
The prepreg dielectric provides excellent heat transfer from the foil and components to the base plate, while maintaining excellent electrical isolation. The base aluminum/copper plate gives the single-sided substrate mechanical integrity, and distributes and transfers the heat to a heat sink, mounting surface or directly to the ambient air.
The Single-Layer MCPCB can be used with surface mount and chip & wire components, and provides much lower thermal resistance than FR4 PWB. The metal core provides lower cost than ceramic substrates, and allows much larger areas than ceramic substrates.
Application of MCPCB
LED lights: High-current LED, Spotlight, high-current PCB
Industrial power equipment: High-power transistors, transistor arrays, push-pull or totem pole output circuit (to tem pole), solid-state relay, pulse motor driver, the engine Computing amplifiers (Operational amplifier for serro-motor), pole-changing device (Inverter)
Cars: firing implement, power regulator, exchange converters, power controllers, variable optical system
Power: voltage regulator series, switching regulator, DC-DC converters
OA: Printer driver, large electronic display substrate, thermal print head
Audio: input - output amplifier, balanced amplifier, pre-shield amplifier, audio amplifier, power amplifier
Others: Semiconductor thermal insulation board, IC arrays, resistor arrays, Ics carrier chip, heat sink, solar cell substrates, semiconductor refrigeration device
Capability
layers:1-4layers
Base material: Aluminum/Copper/Iron Alloy
Thermal Conductivity (dialectical layer): 0.8, 1.5, 2.0, 3.0 W/ m.K.
Withstand voltage: 2000-8000V
Board Thickness: 0.5mm~3.0mm (0.02"~0.12")
Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ
Outline: Routing, punching, V-Cut
Solder mask: White/Black/Blue/Green/Red, Taiyo PSR4000 white
Legend/Silkscreen Color: Black/White
Surface finishing: Immersion Gold, HASL, OSP
Max Panel size: 600*1200 mm (23.62"*47.24")
Packing: Vacuum/Plastic bag
Samples L/T: 4~6 Days
