Electronics SMT PCB Assembly Through-hole copper pcb board Digital
Specifications
1, No MOQ;
2, OEM SMT&DIP Service;
3, 1-22 Layer;
4, UL.ROSH SGS Certification;
5, High quality, low cost&fast delivery.
Welcome to Rigao Electronics .CO.,Ltd.
- Contract Manufacturing
- Engineering Services
- PCB Design & Assembly and copy service
- Prototyping
- Flying Probe Tester
- Cable and Wire Assemblies
- Plastics and Molds
- Fast turn around
1. Double-Sided FR4 material 1 oz copper pcb board
2. Green solder mask, Immersion gold
3. with Competitive price
General Specifications Capability
Material Requirements:
| Size | Max.Finshed Size | 20.9”x24.4”(530mm x 620mm ) |
| Board Thickness | Standard | 0.004”to0.16 ” ±10% ( 0.1mmto4.0mm±10% ) |
| Min. | Single/ Double-sided:0.008”±0.004”(0.2mm ±0.1mm) | |
| 4-layer:0.01”±0.008”(0.4mm ±0.1mm) | ||
| 8-layer :0.01”±0.008”(0.4mm ±0.1mm) | ||
| Bow and twist | < 7/1000 | |
| Copper Weight | Outer Cu weight | 0.5oz ~ 3.0oz |
| Inner Cu wight | 0.5oz ~ 3.0oz | |
| Laminate Materials | FR-4,FR-1,,FR-2,CEM-1,CEM-3 | |
Process Requirements:
| Solder Mask | Color | green,light green,white,black,dark brown,yellow,red,blue |
| Min. solder mask clearance | 0.003”(0.07mm) | |
| Thickness | 0.0005”-0.0007”(0.012mm-0.017mm) | |
| Silkscreen | Color | White,black,yellow,red,blue,green |
| Min. Size | 0.006”(0.15mm) | |
| Surface Finish | HASL,HASL pb free,immersion gold,immersion silver,immersion tin,O.S.P (Entek),S/G plating,ENEPIG,G/F plating,carbon | |
Quality Control:
| Electrical testing | Flying Probe Tester | Y |
| Controlled Impedance | Tolerance | ±10% |
| Impedance tester | Tektronix TDS8200 | |
| Routing | End Mills Test | ± 0.006”(0.15mm) |
| CNC Tolerance | ±0.004”(0.1mm) | |
| V-Cut Depth V-cut | FR-4(1/3+-0.1mm);FR-1,FR-2,CEM-1,CEM-3(1/2+-0.1mm) | |
| V-cut angle V-CUT | 15°,18°,30° | |
| V-CUT | line,hole,V-shape |
Manufacturing Capability for PCB Board
1). Material type: CEM-3,FR-4,FR-4-TG170/TG180,Halogen Free,Rogers,Arlon,Taconic,Isola,PTFE, Bergquist
2). Surface Treatment: HASL,HASL lead-free,HAL,Flash gold,immersion gold,OSP,Gold Finger
Palting,Selective thick gold plating, immersion silver,immersion tin, Carbon ink,peelable mask
3). Solder mask colour: Green/MATT Green/Blue/Yello/White/Black/Red
4). Board Size: 650mm*1000mm
5). Board Layer: 1L-26L
6). Board thickness: 0.2mm to 6.0mm
7). Finished Copper thickness: 0.5 OZ to 6 OZ
8). Min. drilled hole size: 3mil (0.075mm)
9). Min. Line width/Line spacing: 3mil/3mil
10). Copper thickness in hole: >20um
11). Board thickness tolerance: ±10%
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