Polyamide Hot Melt Glue
Description;
Polyamide Hot melt Adhesive formed by the high-temperature condensation reaction of dimer acid and the multi-dimensional amine. It is able to dissolve in general organic solvent. Its melt viscosity has great relationship with the temperature. low viscosity, good flow performance, excellent flexility, and strong cohesive force.
Feature:
1.Good flow performance.
2.Excellent flexility and low viscosity.
3.Strong cohesive force.
Specifications:
|
Style |
Adhesive Hot Melt |
|
Acid Value(mgKOH/g) |
≤10 |
|
Amine Value(mgKOH/g) |
≤8 |
|
Viscosity(mpa.s/160) |
2000-6000 |
|
Softening Point(°C) |
100-180 |
|
Color(Fe-co) |
≤8 |
|
Water absorption (%) |
≤0.5 |
|
Shear strength(mps, AL/AL) |
≥4 |
|
Peeling strength(N/25mm,PE/PE,60±2°C) |
≥100 |
Application:
Polyamide hot melt adhesive is soluble in general organic solvents. It features for its good mechanical strength, good fluidity, excellent tenacity, and high adhesion strength. This product is fit to be used for the adhesion of materials like electric appliances, heat-shrinkable material, packing material, fabrics, leather, lumber, plastic, metal, ceramics, etc.
