Automotive Radar Detector High Frequency PCB Manufacturing Process With Sensor Module

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Automotive Radar Detector High Frequency PCBs  With Sensor Module

 

 

Specification:

 


Board size: 32*16 cm                                              

                

Board thickness: 0.2mm

 

Copper foil: 50UM

 

Layer: 4

 

 

Parameter:

 

F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
 

 

Description:

 

High frequency PCBs with aluminum heat sink for telecommunication and aerospace industries using customer specific electrically and thermally conductive bonding films. Microwave PCB’s: XCE has enormous experience and technical expertise in the manufacturing of time critical, high technology RF circuits. The company works closely with its worldwide customers to deliver prototype-to-large volume manufacturing of circuits. During this process our engineering staff discusses with the customers’ staff to come up with the optimized designs for high quality, low cost and speedy delivery.

 

 

Max panel size 508*610mm
Board thickness toleranceT≥0.8mm±8%,T0.8mm±5%
Wall hole copper thickness 0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)

 


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Mr. KICO
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Shenzhen Xinchenger Electronic Co.,Ltd
515B,BldA,Zhuhuichuangxin Center, Shenzhen, Guangdong, China (Mainland)
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