Item | Specification | Remarks |
Number of Layer | 1-30Layers | |
Material | FR-4,Taconic,Rogers, | High Tg CCL Is available(Tg>=170ºC) |
Metal-backed Laminate | ||
Finish Board Thickness | 0.2mm-3.2mm(8mil-126mil) | |
Minimum Core Thickness | 0.075mm(3mil) | |
Copper Thickness | 1/3 oz min;11 oz max | |
Min.Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) | |
Min.Hole Diameter for CNC Drilling | 0.1mm(4mil) | |
Min.Hole Diameter for punching | 0.6mm(35mil) | |
Biggest panel size | 610mm*508mm | |
Hole Position | +/-0.075mm(3mil) CNC Drilling | |
Conductor Width(W) | +/-0.05mm(2mil)or | |
+/-20% of original artwork | l | |
Hole Diameter(H) | PTH L:+/-0.075mm(3mil) | |
Non-PTH L:+/-0.05mm(2mil) | ||
Outline Tolerance | +/-0.125mm(5mil) CNC Routing | |
+/-0.1mm(6mil) by Punching | ||
Warp & Twist | 0.70% | |
Insulation Resistance | 10Kohm-20Mohm | |
Conductivity | <50ohm | |
Test Voltage | 10-300V | |
Panel Size | 110×100mm(min) | |
660×600mm(max) | ||
Layer-layer migration | 4 layers:0.15mm(6mil)max | |
6 layers:0.25mm(10mil)max | ||
Min.spacing between hole edge to circuity pattern of an inner layer | 0.25mm(10mil) | |
Min.spacing between board outline circuitry pattern of an inner layer | 0.25mm(10mil) | |
Board thickness tolerance | 4 layers:+/-0.13mm(5mil) | |
6 layers:+/-0.15mm(6mil) | ||
Impedance Control | +/-10% | |
Different Impedance | +-/10% |
