0.018mm * 520mm Single Side Shiny RA Cu Foil For FCCL With Japanese Technology
Description :
- Civen RA Copper Foil is rolled from pure copper ingots, the process including purifying copper ores, make into copper cathodes, ingoting, rolling, annealing, washing, testing, slitting and packing.
- Our copper ores are imported from South America, which were famous for their copper mining.
- This is high quality copper and has a wide range of applications based on conductivity, corrosion resistance, workability, and beauty.
- 110-anneal (Electrolytic Tough Pitch or ETP) dead soft. Min 99.96% CU
Applications:
- Flexible Copper Clad Laminate(FCCL)
- Fine Circuit FPC
- LED coated crystal thin film.
Advantange :
- Copper surface are can be increased and can improe the fry or wet green oil film 's adhesion with copper foil.
-
it can supports the Anti-peeling of the solder oil when making HDI board by the mathod of chemical shen tin, chemical nickel gold and etc.
Mechanical Properties :
|
Item |
Unit |
Parameters |
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|
12μm |
18μm |
25μm |
35μm |
70μm |
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|
Mass per unit(±5%) |
g/m² |
105 |
160 |
300 |
400 |
445 |
|
|
Cu+Ag |
% |
≥99.99 |
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|
Temper |
|
H |
O,H |
O,H |
O,H |
O,H |
|
|
Surface roughness |
Ra |
μm |
0.13 |
0.12 |
0.1 |
0.08 |
0.08 |
|
Rz |
μm |
1.3 |
1.0 |
0.8 |
0.74 |
0.76 |
|
|
Tensile strength |
Normal Temp /23 |
N/mm² |
≥430 |
≥450 |
≥450 |
≥450 |
≥450 |
|
High Temp /220 |
N/mm² |
≥140 |
≥150 |
≥170 |
≥210 |
≥220 |
|
|
Elongation |
Normal Temp /23 |
% |
≥1.5 |
≥3.0 |
≥4.0 |
≥4.2 |
≥4.5 |
|
High Temp /220 |
% |
≥8 |
≥10 |
≥18 |
≥28 |
≥30 |
|
|
Fatigue Resistance (annealed) |
% |
65 |
65 |
65 |
65 |
65 |
|
|
Maximum resistivity |
Ωmm2/m |
0.0181 |
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|
Electrical conductivity |
% |
≥98.3% |
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|
Film and adhesive layers |
Instant Temp. 300/10s |
Film and adhesive paste after transient temperature without blistering delamination. |
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|
Anti oxidation |
H.T.(200) |
Minute |
Won’t Change the Color within 60 minutes |
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|
Pinhole test results |
piece/ m² |
Pinhole area more than 0.5 mm²,0.005 piece/ m² |
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Application Show :
Our Packing Condition :
