550mm - 1295mm Width Rolled annealed Copper Foil for Printed Circuit Board

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550mm-1295mm Width ED Copper Foil for Printed Circuit Board 

 

 

Characteristics & Performance:

 

1. HTE, LP or VLP

2. Power Peeling Level: ≤II

3. Width Deviation: by roll~(+2.0,0)  by sheets~(+2.0,-2.0)

4. Area Weight: fits the IPC-4562 3.3 protocol

5. Warranty: 180 days after delivery

6. Storage Conditions: neat and dry, no corruption chemical or wet things nearby.

    Relative Humidity  65%, Temperature:  25°C

7. Packing: Wrapped by thin plastic film and loaded in wooden boxes, then fixed by packing belt.

    A label with be pasted outside, showing product name, nw, gw, Rohs tag and manufacturer. 

 

 

Technical Data:

 

Classification

Unit

9μm

12μm

18μm

35μm

Cu Content

%

≥99.8

Area Weigth

g/m2

80±3

107±3

153±5

283±7

Tensile Strength

R.T.(23)

Kg/mm2

≥28

H.T.(180)

≥15

≥15

≥15

≥18

Elongation

R.T.(23)

%

≥5.0

≥5.0

≥6.0

≥10

H.T.(180)

≥6.0

≥6.0

≥8.0

≥8.0

Roughness

Shiny(Ra)

μm

≤0.43

Matte(Rz)

≤2.5

Peel Strength

R.T.(23)

Kg/cm

≥0.77

≥0.8

≥0.8

≥0.8

Degraded rate of HCΦ(18%-1hr/25)

%

≤7.0

Change of color(E-1.0hr/200)

%

Good

Solder Floating 290

Sec.

≥20

Appearance(Spot and copper powder)

----

None

Pinhole

EA

Zero

Size Tolerance

Width

mm

0~2mm

Length

mm

----

Core

Mm/inch

Inside Diameter 79mm/3 inch

 

Application

 


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Mr. Duearwin Moon
Tel: 86-21-56351345
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Civen Metal Material Co.,Ltd
Office: Room No. 1#B107, No.666 Xincun Road, Shanghai, China (Mainland)
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