2.6lp/mm Resolution Dental Imaging Systems / Dental Cone beam CTmachine

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2.6lp/mm Resolution Dental Imaging Systems / Dental Cone beam CT machine

 

Features of HiRes3D

 

 

Flexible FOV

All kinds of dental clinical requirements would be solved accordingly by the flexible FOV like 3D TMJ view, Skull PA & LAT.

 

Unique Metal Artifact removal technology

Image quality is not affected by implants, metal materials or other high-density materials.

 

Accurate scan design

360 degree no blind angle scanning

 

Super-high Resolution

The image resolution is as high as 2.6lp/mm, the best in the world. Such a high resolution makes the equipment able to clearly display microscopic structures of dental anatomies in 3D images.

 

 

 

Super-fast Speed

High-definition 3D image reconstruction of the whole oral cavity can be finished in 15 seconds, the fastest in the world. High-resolution 3D image can be seen instantly after scan.

 

 

 

 

Ultra-low Dose level

Lower radiation dose for an improved protection.

 

Patient positioning system

Excellent practice feeling to minimize patient movement and prevent artifacts.

 

Powerful dental application software Smart V

Smart operation interface, Reliable analysis systems greatly reduce the risk of surgery.

 

Worldwide After-sales Service System

 

Backed with the abundant domestic after-sales services resources of its parent company Nuctech,Largev has set up seven regional centres for china, Asia & Oceania , Asia & CIS, the West Asia, Europe, Africa, and America, covering more than 120 countries and regions in five continents.

 

 

Introduction to HiRes3D

Developed and manufactured by LargeV independently and all related intellectual property rights are owned by LargeV.

With world-leading technical index, HiRes3D fully meets clinical needs, and is safe and reliable.

 

 

SmartV Clinical Cases

 

 

Implants, Extractions, Root Evaluations

 

Endodontics-Periodontics Diagnosis

 

Oral and maxillofacial Surgery

 

TMJ Diagnosis

 

Skull PA & LAT Analysis

 

 

 

                                                                        Technical Specifications

 
 

Model

                                                  HiRes3D

 

Field of View           

(mm * mm)

160 * 150

230 * 180

 

160 * 80

160 * 150

160 * 80

160 * 100

 

160 * 80

80 * 80

160 * 50

 

50 * 80

80 * 80

 

Voxel Size

0.25mm

0.25mm

0.25mm

0.25mm

 

0.125mm

0.125mm

0.2mm

 

0.1mm

0.125mm

 

0.075mm

0.075mm

 

Spatial Resolution

2.0 lp/mm

2.0 lp/mm

2.6 lp/mm

2.6 lp/mm

 

Reconstruction Time

≤15s

10-150s

10-150s

≤60s

 

Tube Current

                            2-4mA

2-10mA

 

Tube Voltage

                           80-100kV

60-100kV

 

Scan Time

15s

 

Focal Spot Size

0.4(IEC336)

 

Sensor Type

Flat Panel Detector

 

Weight

340kg

 

Power Requirements

AC220V±10%, 50Hz,660VA

 

Outer Dimensions

1206mm * 1579mm * 2301mm

 

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Mr. Mr. Kevin Peng
Tel: 86-10-83186501
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LargeV Instrument Corp. Ltd.
A-800B,Tongfang Building, QingHuaYuan, Beijing, China (Mainland)
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