HIT RFID Tag Flip-Chip Bonding Machine

Price: 200000.0 USD
Payment Terms: T/T
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Basic Info.
  • Processing: Labeling Machine 
  • Automatic Grade: Automatic 
  • Type: General 
  • Usage: Outer 
  • Packaging: Paper 
  • Brand Name: HIT 
  • Model No.: Hei-Diii 
  • Place of Origin: Hubei  
  • Min.Order: 1 Set/Sets
  • Means of Transport: Ocean
Supply Capacity
  • Production Capacity: 30Sets/Month
  • Packing:Wooden/metal box
  • Delivery Date: around 30 days

Features: 
Based on high-precision positioning technology such as the visual image processing guiding, high-speed trajectory-timing planning and closed-loop control of grating precision feedback, achieve to place microchip (minimum 0.3 x 0.3mm² chip) fast, precisely and cost effective 
Via tension-positioning mixed control or distributed control, achieve to feed and place precisely in multiple amplitude and long-span flexible membrane matching the point-by-point positioning technology, could adapt domestically antenna substrate and make the antenna cost lower more than 50% than imported substrate 
Use time pressure of non 
Newtonian fluid dispensing process control technology to achieve the precise control of the amount of glue and save 30% of the cost compared with traditional dispensing process 
Use the intermittent movement, the tact control technology of the optimized components to improve the stability of the system while reducing the overall energy consumption more than 60% 

Applications: 
It's applicable to various types of HF/UHF inlay packaging of the field applications, logistics management and traceability, merchants anti-counterfeiting and management, manufacturing logistics and monitor


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Mr. Yoseph Tsin
Tel: 86-711-3818946
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Hubei Huaweike Intelligent Technology Co., Ltd.
No. 1, Construction Avenue, Gedian ETDZ, Ezhou, Hubei, China (Mainland)
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