Led Light Metal Core PCB Through Hole Plating 0.6mm Double Sided

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Led Light Metal Core PCB Through Hole Plating 0.6mm Double Sided


PCB properties

PCB SIZE 85 x 91mm=9PCS
Number of Layers Double sided PCB, Metal core PCB
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 35um(1oz)+PLATE
1W/MK dielectric material
Aluminum 1060
1W/MK dielectric material
copper ------- 35um(1oz)+PLATE
Minimum Trace and Space: 13mil/14mil
Minmum / Maximum Holes: 1.5/3.3mm
Number of Different Holes: 4
Number of Drill Holes: 9
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control no
Thermal conductivity 1W/MK dielectric material, MCPCB
Final foil external: 1oz
Final foil internal: 1oz
Final height of PCB: 0.6mm ±0.1
Surface Finish Hot Air Soldering Leveling(HASL),lead free, Sn>=2.54µm
Solder Mask Apply To: Top and Bottom. 12micon Minimum.
Solder Mask Color: Blask
Solder Mask Type: LPSM
Side of Component Legend TOP
Colour of Component Legend White
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA via tented.
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.




a) Metal core PCB. RoHS compliant.

b) More suitable for SMT process.

c) Meeting your printed circuit board needs from PCB prototyping to mass volume production.

d) DDU Door to door shipment with competitive shipping cost. You don’t need to arrange anything after confirming the order. Just wait for your PCB delivery to your hand.



More Applications In Electronics

AC/DC Adapter
Car Power Inverter
Wireless Dongle
Car Inverter
Wireless Usb Hub

Gsm Module
Gsm Repeater
Gsm Tracking
Fta Satellite
Mobile Satellite



PCB knowledge: The Difficulty Factors for Multilayer boards

Multilayer PCB’s represent one of the most complicates products in PCB industry. In order to design producible multilayer PCB’s, it is imperative that PCB designers understand the processes and difficulty factors



The more layers in a multilayer PCB’s, the greater risk of mis-registration during laminate process. The difficulty factor, therefore, increase with an increasing layer counts.

*Core thickness of rigid inner laminates

Inner layers are normally based on thin rigid laminate cores with copper cladding. The thinner the rigid laminates, the more difficult they are to handle, for example, in the etching process.

*Thickness tolerance (total thickness inclusive of copper foils)

The difficulty factor and the rejection rate depend very much upon the thickness tolerance required, and indirectly upon the layer build-up. When thickness tolerance T=±10%, obviously rejection ratio trends to zero.



How do you control the quality?
We believe engineering design prevents problems from occurring in preproduction. Our PCB and Manufacturing process are certified by authorized organizations.
100% tests are inclusive of electrical test and AOI inspection, high voltage test, impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc.

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Mr. Mr. Kevin Liao
Tel: 86-755-27374946
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3 203 Shidai Jingyuan Fuyong Town,undefined,undefined, Shenzhen, Guangdong, China (Mainland)
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