Blue 10 Layer High Tg PCB 1oz FR 4 4mil Prepreg High Layer Count PCB
PCB data sheets
| PCB SIZE | 97 x 97mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 10 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1oz)+plate TOP Signal |
| 4mil prepreg | |
| copper ------- 18um(0.5oz) GND Plane | |
| 5mil FR-4 | |
| copper ------- 18um(0.5oz) SIG1 | |
| 5mil prepreg | |
| copper ------- 18um(0.5oz) SIG2 | |
| 5mil FR-4 | |
| copper ------- 18um(0.5oz) PWR Plane | |
| 13mil prepreg | |
| copper ------- 18um(0.5oz) GND Plane | |
| 5mil FR-4 | |
| copper ------- 18um(0.5oz) SIG3 | |
| 5mil prepreg | |
| copper ------- 35um(1oz) SIG4 | |
| 5mil FR-4 | |
| copper ------- 35um(1oz) GND Plane | |
| 4mil prepreg | |
| copper ------- 35um(1oz)+plate BOT Signal | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5.5mil/5mil |
| Minmum / Maximum Holes: | 0.0.5/2.0mm |
| Number of Different Holes: | 2 |
| Number of Drill Holes: | 532 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | NO |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-180, TG>170, er<5.4 |
| Final foil external: | 1.5oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Electroless Nickle over Immersion Gold (ENIG)( 1 µ" over 100 µ" nickle) |
| Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
| Solder Mask Color: | Blue, Kuangshun, KSM-6189BL04 |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing, Fiducial marks |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), via tented. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | Signal processor |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages
a) High Tg FR-4 epoxy glass and Prepreg. Industrial standard material with high Tg (175 by DSC) and excellent thermal reliability.
b) Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260
c) 100% tests inclusive of electrical test and AOI inspection.High voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc.
d) Meeting your printed circuit board needs from PCB prototyping to mass volume production.
More Applications in Electronics
Small Led Lights
Contract Manufacturing
Wireless Adapter For Desktop
Wholesale Electronics
24 Port Switch
Power Supplies
Dc-Ac Converter
Dc-Dc Converter
Commutator
Motor Driver
PCB Knowledge: Specifications of FR-4
When ordering a copper clad laminate board, the FR-4 thickness and the copper foil thickness must be specified separately.
FR-4 thickness is specified in thou or inches, and common thicknesses range from 10 thou (0.010 in, 254 µm) to 3 inches (76 mm).
Copper foil thickness is specified in units of ounces per square foot (oz/ft2), commonly referred to simply as ounce. Common thicknesses are 1 oz/ft2 (300 g/m2), 2 oz/ft2 (600 g/m2), and 3 oz/ft2 (900 g/m2). These work out to thicknesses of 34.1 µm (1.34 thou), 68.2 µm (2.68 thou), and 102.3 µm (4.02 thou), respectively. Some PCB manufacturers refer to 1 oz/ft2 copper foil as having a thickness of 35 µm (may also be referred to as 35 μ, 35 micron, or 35 mic).
1/0 - denotes 1 oz/ft2 copper one side, with no copper on the other side.
1/1 - denotes 1 oz/ft2 copper on both sides.
H/0 or H/H - denotes 0.5 oz/ft2 copper on one or both sides, respectively.
2/0 or 2/2 - denotes 2 oz/ft2 copper on one or both sides, respectively.
Due to the development needs of electronic product installation technology and PCB technology, the high Tg (Glass temperature) FR-4 products was born.
FAQ
How do you control the quality?
We believe engineering design prevents problems from occurring in preproduction. Our PCB and Manufacturing process are certified by authorized organizations.
100% tests are inclusive of electrical test and AOI inspection, high voltage test, impedance control test, micro-section, solder-ability test, thermal stress test,
reliability test, insulation resistance test and ionic contaminatio
