Tg 170 16 Layer BGA PCB Immersion Gold Fr4 Circuit Board 2.4mm
PCB Propteries
| PCB SIZE | 260 x 167mm=1PCS=1design |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 16 layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- TOP 17um(1oz)+plate |
| 65 um prepreg 1080 x 1 | |
| copper ------- L02 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L03 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L04 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L05 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L06 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L07 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L08 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L09 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L10 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L11 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- L12 35um(1oz) | |
| 150um core FR-4 | |
| copper ------- L13 35um(1oz) | |
| 65 um prepreg 1080 x 1 | |
| copper ------- BOT 17um(0.5oz)+plate | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4.5mil/4.5mil |
| Minmum / Maximum Holes: | 0.36/2.5mm |
| Number of Different Holes: | 13 |
| Number of Drill Holes: | 2519 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | 0 |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | IT180A, FR-4 TG170, er<5.4, ITEQ Supplied |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 2.4mm ±0.2 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold 0.05µm over 3µm Nickel (45% area) |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, PSR-2000 GT600D, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), BGA, Epoxy Via plugging |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | Communication systems |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages
a) High temperature PCB. Excellent thermal reliability and CAF resistance providing long-term reliability for industrial and automobile application.
b) Electroless nickel immersion gold. High solderability, no stressing of circuit boards and less contamination of PCB surface.
c) No MOQ, low cost for small quantity prototypes and samples.
d) Meeting your printed circuit board needs from PCB prototyping to mass volume production.
More Applications
Car Tracker GPS
GPS Tracking For Cars
Embedded Operating System
GPS Fleet Management
Vehicle Tracking Systems
PCB knowledge: The components of multilayer PCB--- thin laminates
A multilayer board consists of copper foils, thin rigid laminates and prepreg sheets.
Thin laminates are used for inner cores and are available in so many different thicknesses that almost any specified build-up can be accomplished.
Different thickness of thin laminates
| mm | mils | mm | mils | |
| 0.050 | 2 | 0.360 | 14 | |
| 0.075 | 3 | 0.410 | 16 | |
| 0.100 | 4 | 0.460 | 18 | |
| 0.125 | 5 | 0.510 | 20 | |
| 0.150 | 6 | 0.560 | 22 | |
| 0.175 | 7 | 0.610 | 24 | |
| 0.200 | 8 | 0.660 | 26 | |
| 0.250 | 10 | 0.710 | 28 | |
| 0.300 | 12 | 0.760 | 30 |
The thicknesses are valid for the bare laminate, with the copper foil being excluded. We can see the cores are quite thin. For a total thickness of 1.6mm (0.063inch) board, the more layers, the thinner the laminates should be. See our reference Multilayer PCB stackup for 0.063inch thick.
Multilayer PCB stackup: 12 layer 1.6mm Finished Thickness
This is reference layer stackup. The stackup of multilayer PCB’s can be reached in many different ways.
FAQ
How do you control the quality?
We believe engineering design prevents problems from occurring in preproduction. Our PCB and Manufacturing process are certified by authorized organizations.
100% tests are inclusive of electrical test and AOI inspection, high voltage test, impedance control test, micro-section, solder-ability test, thermal stress test,
reliability test, insulation resistance test and ionic contamination test etc.
