DP Semiconductor Side-pump Laser Marking Machine

a. Using  the most advanced semiconductor laser technology,and the imported semiconductor laser diode pumped Nd: YAG medium with a wavelength of 808nm is employed . The optical path system adopts a hermetically sealed structure , with optical path preview and focus indication functions, more beautiful appearance and the operation is more convenient. This machine is equipped with the latest external cooled system ,low operation noise, high precision temperature control , providing reliable guarantee for long time operation .Its integrated structure for laser, electrical source and workbench , high efficiency marking, and laser marking effect is good .The machine has high electric/optical conversion rate .Through computer controlling to change the road of the laser beam to realize automatic marking .The marks mean a breakthrough in the laser marking field ,with advantages such as low energy consumption,,high reliability ,small size of the facula , high pricaision marking , speed ,etc .which provide 24-hour continuous operation of the marks.

b. The software runs in the window interface,it is compatible with multiple types of software such as Autocad, Coreldraw and Photoshop ,  and with multiple file formats such as PLT , PCX , DXF and BMP . At the same time, it can directly use SHX and TTF font libraries. Supporting automatic coding, serial number, batch number, date, bar code and quickmark marking ,the software has function of playing reverse graphics .

a.Metallic and non-metallic materials. Especially applicable to processing products requiring fineness and high precision.
b.Applicable to electronic components, ICs, electric appliances, handsets, hardware, tools, parts, precision machinery, lens, clocks, watches, jewelries, auto parts, plastic buttons, building materials, PVC pipelines, and medical instruments.
c.Plain metals and their alloys (iron, steel, aluminum, magnesium and zinc), rare metals and their alloys (gold, silver and titanium), metallic oxides, special surface treatment (phosphorized, aluminum anodized and galvanized surfaces), ABS (cases for electric appliances and daily articles), printing ink (transparent buttons and printed matters), and epoxy resin (encapsulation of electronic components, and insulating layers).