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[Province: Guangdong ]   
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aluminum base copper clad laminate
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aluminum base copper clad laminate

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Thermal Conductivity
(W/m.k)
A
1~1.5
 
Peel Strength
(N/mm)
A
After thermal stress
≥1.8
Blister Test after Thermal Stress
A
After thermal impact
260℃2min
Flammability
UL94
V-0
Thermal Resistance Max
(℃/W)
A
≤1.2
Surface Resistivity
(MΩ.m)
A
Constant humidity treatment (90%, 35 ℃,96H)
≥1×105
Volume Resistivety
(MΩ.m)
A
(90%,35 ℃,96H)
≥1.8×106
Dielectric Breakdown Min (KV)
A
≥2.0
 
Dielectric Constant
(1MHz)
(40 ℃,90%,96H)
≤4.4
Dissipation Factor
(40 ℃,90%,96H)
≤0.03

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Ms. JoJo Liu
Tel: 86-756-3236181
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Zhuhai Sanny Co., Ltd
No.1164,Jiuzhou Road East, Jida, Zhuhai, Guangdong, China (Mainland)
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