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8 layer PCB
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8 layer PCB

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PCB Technical Capacity
1.Base Materials:High Temperature FR4/FR5,Free halogen FR4,Aluminium Based,Polyimide,Rogers,Arlon ,Other Teflon / PTFE
 
2.Layers:1-30 layers standard PCB,Cross Blind Vias and Buried Vias Board
3.Minimum Track Space:3mil/4mil,
4..Maximum Size:1000mm*1200mm
5.Surface Copper Thickness:Maximum:6/6 oz,Minimum:0.5/0.5 oz
6.Hard Gold thickness:Maximum:100U ''
7. Maximum Board Thickness:6.0mm
8.Finishes:SMOBC/HASL,Lead Free SMOBC/HASL,Organic OSP,Hard & Soft Gold,Plating Tin,Immersion Silver,Immersion Tin,Electroless Nickel/Immersion Gold

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Ms. Winnie Hu (Sales Engineer)
Tel: 86-755-26054178
Mobile: 13760397193
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Contact Method
ABP ELECTRONICS LIMITED
10th Building,Zhongxing Industrial Zone,Chuangye Road, Nanshan District, Shenzhen, Guangdong, China (Mainland) / 518054
Fax: 86-755-26435488
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