Aluminium based copper clad laminate is a kind of composite insulation sheet made of Aluminium based sheet,insulation material,copper foil.
Aluminium based copper clad laminate has excellent thermal performance and mechanical processing properties, electromagnetic shielding, dimensional stability, magnetic properties and multi-functional performance, applications in industrial power equipment, automotive, power supply, tape recorders, audio, office automation, computers, etc. field, as follows:
1, Industrial Power Equipment
High-power transistors, transistor arrays, push-pull or totem pole output circuit, solid state relays, pulse motor drives, motors operational amplifiers, inverters.
High-power transistors, transistor arrays, push-pull or totem pole output circuit, solid state relays, pulse motor drives, motors operational amplifiers, inverters.
2,car
Ignition, power conditioners, AC switches, power controllers, dimmer system.
Ignition, power conditioners, AC switches, power controllers, dimmer system.
3, power
Series regulators, switching regulators, DC-DC converter.
Series regulators, switching regulators, DC-DC converter.
4, tape recorders (VTR-TV)
Regulators, motor drivers, signal splitters, amplifiers.
Regulators, motor drivers, signal splitters, amplifiers.
5, audio
Input - output amplifiers, balanced amplifiers, front cover amplifiers, audio amplifiers, power amplifiers.
Input - output amplifiers, balanced amplifiers, front cover amplifiers, audio amplifiers, power amplifiers.
6, office automation
Printer driver, a large electronic display substrate, thermal print head.
Printer driver, a large electronic display substrate, thermal print head.
7, computer.
CPU board, floppy disk drive, power supply units.
CPU board, floppy disk drive, power supply units.
8,others
Semiconductor thermal insulation board, IC arrays, resistor arrays, ICS-carrier chip,heat sink, solar cell substrates, semiconductor cooling device.
Semiconductor thermal insulation board, IC arrays, resistor arrays, ICS-carrier chip,heat sink, solar cell substrates, semiconductor cooling device.
| No. | Test Item | Condition | Unit | Typical Value |
| Aluminium ccl | ||||
| 1 | Laminate style | Al3003 | ||
| 2 | Thickness tolerance | within 0.1mm | ||
| 3 | Dielectric thickness | um | 70 | |
| 4 | Peel strength | 288oC 10s | N/mm | 1.78 |
| 5 | Breakdown voltage | AC | KV | >2 |
| 6 | Surface resistivity | C-96/35/90 | MΩ | 2.0×108 |
| 7 | Volume resistivity | C-96/35/90 | MΩ·cm | 3.0×107 |
| 8 | Dielectric constant 1MHz | C-96/35/90 | 3.15 | |
| 9 | Dielectric loss 1MHz | C-96/35/90 | 0.025 | |
| 10 | Thermal stress | 288oC No delamination Non-foaming | s | 40 |
| 11 | Flammability | UL94 | V-o | |
| 12 | Thermal resistance | ℃/W | 0.5 | |
| 13 | Thermal conductivity | W/m·k | 1.23 | |
| 14 | Tg (DSC) | ℃ | 138 |
