Product Description 1. 0402 to 1206 placement, IC precision: 0.4mm pinch distance;
2. BGA precision: 0.8mm globe center distance
3. Automated axial insertion and Automated radial insertion
4. Computer controlled wave soldering
5. Two SMT production lines and two dip lines
6. Providing electronic components purchase service for the customers
7. Visual inspection, ICT inspection
2. BGA precision: 0.8mm globe center distance
3. Automated axial insertion and Automated radial insertion
4. Computer controlled wave soldering
5. Two SMT production lines and two dip lines
6. Providing electronic components purchase service for the customers
7. Visual inspection, ICT inspection
