Applications | Special in printed circuit board, motherboard, high temperature resistant label. The mobile phone | |
Technical parameters | Choose polyimide film as the base material, high temperature resistant. | |
Model | 651 | |
Thickness (mm) | 0.075-0.1 | |
Adhesion(n/25mm) | 6 | |
Tensile strength(n/25mm) | 130-160 | |
Elongation (%) | 55-70 | |
Temperature resistance(℃) | 260 | |
Dielectric strength(KV) | 1 | |
Size | ||
Length (m) | 33 | |
Width (mm) | 500 |
Product Description
PCB with high temperature resistant bar code labels PI: first use polyimide film as the base material, high temperature resistant, USES in the printed circuit board, motherboard, high temperature resistant label. The mobile phone.
PCB with high temperature resistant bar code labels PI: first use polyimide film as the base material, high temperature resistant, USES in the printed circuit board, motherboard, high temperature resistant label. The mobile phone.
