- Layers: 6
- Material: tg170 FR4
- Solder mask color: blue
- Copper thickness: 2oz
- Board thickness: 2.0mm
- Surface finish: gold finger and BGA
- Packing: vacuum
- Technical capability:
- Layers: 2 to 16 layers
- Maximum board size: 800 x 508mm
- Finished board thickness: 0.2 to 4.0mm
- Minimum line width: 4mil
- Minimum line space: 4mil
- Minimum hole size: 0.15mm
- PTH wall thickness: 0.8mil
- PTH diameter tolerance: ±2mil
- NPTH hole diameter tolerance: ±1mil
- Hole position deviation: ±2mil
- Outline tolerance: ±4mil
- S/M pitch: 3mil
- Insulation resistance: 1E + 12Ω (normal)
- Aspect ratio: 10:1
- Thermal shock: 3 x 10sec @ 288℃
- Warp and twist: ≤0.5%
- Electric strength: >1.3kV/mm
- Peel strength: >=61BIN (>=107g/mm)
- Solder mask abrasion: ≥6H
- Flammability: 94V-0
- Impedance control: 50 Ohms, +/-10%
- Surface treatment: HASL, immersion gold, flash gold, OSP and gold finger
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6 Layer PCB, Multilayer PCB
6 Layer PCB, Multilayer PCB
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Basic Info.
- Number of Layers: 6-Layer
- Base Material: FR-4
- Copper Thickness: 2oz
- Board Thickness: 1.6mm
- Place of Origin: Guangdong
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