Quality
Our UL/Rohs standards insure quality assemblies from start to finish. Whether it's a simple custom product or a complex turnkey production run, YZX will adhere to the highest quality standards.
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Capable
YZX offers the latest in assembly capabilities and qualifications insuring that quality is built
into every product we produce.
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Experience
When it comes to your build you want a partner you can depend on. Our management team has over 10years of combined industry knowledge. Our engineering team has over 7 years experience.
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Protecting your interests
Protecting your Intellectual Property is job one! Our staff of trained professionals are all working under a strict confidentiality contract and treat your important documentation as they would their own.
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Flexibility
We pride ourselves on our ability to custom tailor programs around our customers' needs. We take time to listen to your unique business needs and then set out to surpass them.
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Experience
When it comes to your build you want a partner you can depend on. Our management team has over 10years of combined industry knowledge. Our engineering team has over 7 years experience.
--------------------------------------------------------------------------------
Protecting your interests
Protecting your Intellectual Property is job one! Our staff of trained professionals are all working under a strict confidentiality contract and treat your important documentation as they would their own.
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Flexibility
We pride ourselves on our ability to custom tailor programs around our customers' needs. We take time to listen to your unique business needs and then set out to surpass them.
PCB Technical Capacity
Files | Gerber, Protel, Powerpcb, Autocad, Orcad, etc |
Material | FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic) |
Layer No. | 1 - 20 Layers |
Board thickness | 0.0075"(0.2mm)-0.125"(3.2mm) |
Board Thickness Tolerance | ±10% |
Copper thickness | 0.5OZ - 4OZ |
Impedance Control | ±10% |
Warpage | 0.075%-1.5% |
Peelable | 0.012"(0.3mm)-0.02'(0.5mm) |
Min Trace Width (a) | 0.005"(0.125mm) |
Min Space Width (b) | 0.005"(0.125mm) |
Min Annular Ring | 0.005"(0.125mm) |
SMD Pitch (a) | 0.012"(0.3mm) |
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) | 0.027"(0.675mm) |
Regesiter tolerance | 0.05mm |
Min Solder Mask Dam (a) | 0.005"(0.125mm) |
Soldermask Clearance (b) | 0.005"(0.125mm) |
Min SMT Pad spacing (c) | 0.004"(0.1mm) |
Solder Mask Thickness | 0.0007"(0.018mm) |
Hole size | 0.01"(0.25mm)-- 0.257"(6.5mm) |
Hole Size Tol (+/-) | ±0.003"(±0.0762mm) |
Aspect Ratio | 6:01 |
Hole Registration | 0.004"(0.1mm) |
HASL | 2.5um |
Lead free HASL | 2.5um |
Immersion Gold | Nickel 3-7um Au:1-3u'' |
OSP | 0.2-0.5um |
Panel Outline Tol (+/-) | ±0.004''(±0.1mm) |
Beveling | 30°45° |
V-cut | 15° 30° 45° 60° |
Surface finish | HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
Certificate | ROHS ISO9001:2000 TS16949 SGS UL |
Special requirements | Buried and blind vias, Impedance control, via plug, BGA soldering and gold finger |
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