Green High Frequency PCB Immersion Gold 30mil 1oz For RF Transmitter
PCB Properties
| PCB SIZE | 191 x 83mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Double sided PCB |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 35um(1oz)+plate TOP layer |
| RO4350B 30mil (0.762mm) | |
| copper ------- 35um(1oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5.6mil/5.3mil |
| Minmum / Maximum Holes: | 0.59/5.1mm |
| Number of Different Holes: | 8 |
| Number of Drill Holes: | 183 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | NO |
| BOARD MATERIAL | |
| Glass Epoxy: | RO4350B 30mil (0.762mm), Tg 288 |
| Final foil external: | 1.5oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 0.8mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Electroless Nickle over Immersion Gold (ENIG)( 1 µ" over 100 µ" nickle) |
| Solder Mask Apply To: | Top,12micon Minimum. |
| Solder Mask Color: | Green, PSR-2000GT600D, Taiyo supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), Via tented |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | RF transmitter |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages
a) RO4350B base material. Stable electrical coefficient of dielectric constant.
b) Excellent high frequency performance due to low dielectric tolerance and loss.
c) Delivery on time. We keep higher than 95% on-time-delivery rate.
d) No MOQ, low cost for small quantity prototypes and samples.
More Applications in Electronics
AC DC Power Supply
Router Wifi 3G
AC/DC Adaptor
Broadband Modem
Power Adaptor
PCB knowledge: Layer Stackup
The purpose of stackup is to interleave the thin laminates and the prepreg sheets in correct sequence and ensure correct layer-to-layer registration. The stackup of multilayer boards can be done in many different ways.
Hybrid PCB stack up
4 layer PCB, RO4350B combined with FR-4 Core.
Genuine RO4350B 4 layer PCB vs FR-4 4 layer PCB
Build-up of FR-4 PCB (4 layer) Build-up of RO4350B PCB (4 layer)
Copper track --- Layer 1 Copper track --- Layer 1
Prepreg(PP) RO4350B Core
Copper track --- Layer 2 Copper track --- Layer 2
FR-4 Core Rogers Prepreg(PP)
Copper track --- Layer 3 Copper track --- Layer 3
Prepreg(PP) RO4350B Core
Copper track --- Layer 4 Copper track --- Layer 4
FAQ
How do you control the quality?
We believe engineering design prevents problems from occurring in preproduction. Our PCB and Manufacturing process are certified by authorized organizations.
100% tests are inclusive of electrical test and AOI inspection, high voltage test, impedance control test, micro-section, solder-ability test, thermal stress test,
reliability test, insulation resistance test and ionic contamination test etc.
