Tg 135 Fr4 Epoxy Glass Printed Circuit Board Pcb 6 Layers 0.6mm 0.5 Oz
PCB parameters
| PCB SIZE | 100 x 100mm=49PCS |
| BOARD TYPE | |
| Number of Layers | Multilayer, 6 layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP CS |
| 4mil prepreg | |
| copper ------- 18um(0.5oz) GND Plane | |
| 5mil FR-4 | |
| copper ------- 18um(0.5oz) PWR Plane | |
| 4mil prepreg | |
| copper ------- 18um(0.5oz) PWR Plane | |
| 4mil FR-4 | |
| copper ------- 18um(0.5oz) SIG | |
| 4mil prepreg | |
| copper ------- 18um(0.5oz) BOT PS | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4mil/4mil |
| Minmum / Maximum Holes: | 0.4/2.50mm |
| Number of Different Holes: | 30 |
| Number of Drill Holes: | 1512 |
| Number of Milled Slots: | 8 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | ITEQ IT140 TG>135, er<5.4 |
| Final foil external: | 1oz |
| Final foil internal: | 0.5oz |
| Final height of PCB: | 0.6mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold 0.025µm over 3µm Nickel (15% area) |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Gloss Green, Taiyo PSR-2000GT600D |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | No silkscreen requried. |
| Colour of Component Legend | No silkscreen requried. |
| Manufacturer Name or Logo: | No silkscreen requried. |
| VIA | Plated through hole(PTH), Via in Pad and via capping on CS and PS, vias should not be visible. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | GPRS Modem |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages
a) Products and Manufacturing are certified by authorized organizations.
b) No minimum order quantity. 1-10 pieces are offered for sale.
c) ISO certified PCB manufacturing factory.
d) Eligible products rate of first production: >95%
e) DDU Door to door shipment with competitive shipping cost. You don’t need to arrange anything after confirming the order. Just wait for your PCB delivery to your hand.
More Applications in Electronics
DC-AC Converter
Power Module
Industrial Computer
Modem Adsl Wifi
AC Converter
PCB knowledge: Glass Transition Temperature (Tg)
The thermal properties of the resin system are characterized by the glass transition temperature (Tg), which always is expressed in °C. The most commonly used property is the thermal expansion. When measuring the expansion versus the temperature, we can get a curve as shown in following picture. The Tg is determined by the intersection of the tangents of the flat and steep parts of the expansion curve. Below the glass transition temperature, the epoxy resin is rigid and glassy. When the glass transition temperature is exceeded, it changes to a soft and rubbery state.
For the most commonly used types of epoxy resin (FR-4 grade), the glass transition temperature is in the range 115-130°C, so when the board is soldered, the glass transition temperature is easily exceeded. The board expands in the Z-axis direction and stresses the copper of the hole wall. The expansion of epoxy resin is about 15 to 20 times greater than that of copper when exceeding Tg. This implies a certain risk of wall cracking in plated-through holes, and the more resin around the hole wall, the greater risk. Below the glass transition temperature, the expansion ratio between epoxy and copper is only three times, so here the risk of cracking is negligible.
FAQ
Do you sell high frequency PCB?
Yes. We offer high frequency PCB and hybrid of high frequency and FR-4 mixed. The most used high frequency material is RO4350B and RO4003C, double sided and multilayer.
