Yellow White light emitting diode led Chip material AlGaInP InGaN Square With 5mm Dome 4 Lead

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Yellow White light emitting diode led Chip material AlGaInP InGaN Square With 5mm Dome 4 Lead

 

LED Light Emitting Diode

 

  1. Features:
  1. Automotive exterior lighting.
  2. Electronic signs and signals.
  3. Special lighting application.
  4.  

  5. Applications:
  6. This revolutionary package design allows the light designer to reduce the number of LEDs required and provide a more uniform and unique illuminated appearance than with other LED solutions.
  7. The low profile package can be easily coupled with reflectors or lenses to efficiently distribute light and provide the desired light appearance.
  8.  

  9. Descriptions:
  10. Fewer LEDs required.
  11. Low profile.
  12. Lowers lighting system cost.
  13. Super flux output.
  14. Viewing angle=70°.
  15. The product itself will remain within RoHS compliant Version.
Part No. Chip Material Lens Color Source Color
DL-U50-2UYW45 AlGaInP Water Clear Super Yellow

 

 

 

 

 

  1. Reliability Test
  2. Classification Test Item Reference Standard Test Conditions Result

     

     

     

     

     

     

     

     

    Endurance Test

     

     

     

    Operation Life

    MIL-STD-750:1026

    MIL-STD-883:1005

    JIS-C-7021 :B-1

     

    Connect with a power If=20mA

    Ta=Under room temperature

    Test time=1,000hrs

    0/20

     

    High Temperature

    High Humidity

    Storage

    MIL-STD-202:103B

    JIS-C-7021 :B-11

     

    Ta=+65±5

    RH=90%-95%

    Test time=240hrs

     

    0/20

     

    High Temperature

    Storage

    MIL-STD-883:1008

    JIS-C-7021 :B-10

     

    High Ta=85±5

    Test time=1,000hrs 0/20

    0/20

     

    Low Temperature

    Storage

    JIS-C-7021 :B-12

     

    Low Ta=-35±5

    Test time=1,000hrs

    0/20

     

     

     

     

     

    Environmental Test

     

     

     

     

     

    Temperature Cycling

    MIL-STD-202:107D

    MIL-STD-750:1051

    MIL-STD-883:1010

    JIS-C-7021 :A-4

    -35 ~ +25 ~ +85 ~ +25

    60min 20min 60min 20min

    Test Time=5cycle

    0/20

     

    Thermal Shock

    MIL-STD-202:107D

    MIL-STD-750:1051

    MIL-STD-883:1011

    35±5 ~+85±5

    20min 20min

    Test Time=10cycle

    0/20

     

    Solder Resistance

    MIL-STD-202:201A

    MIL-STD-750:2031

    JIS-C-7021 :A-1

    Preheating:

    140-160, within 2 minutes.

    Operation heating: 235 (Max.), within 10seconds (Max.)

    0/20

     

     

     

  3. Judgment criteria of failure for the reliability
  4. Measuring items Symbol Measuring conditions Judgment criteria for failure
    Forward voltage VF (V) IF=20mA Over Ux1.2
    Reverse current IR(uA) VR=5V Over Ux2
    Luminous intensity Iv (mcd) IF=20mA Below SX0.5
     
  5.  
  6. Absolute Maximum Ratings at Ta=25

 

Parameters Symbol Max. Unit
Power Dissipation Yellow PD 45 mW
White 70

Peak Forward Current

(1/10 Duty Cycle, 0.1ms Pulse Width)

IFP 160 mA
Chip Forward Current IF 30 mA
Reverse Voltage VR 5 V
Operating Temperature Range Topr -40 to +85
Storage Temperature Range Tstg -40 to +100

Lead Soldering Temperature

[4mm (.157″) From Body]

Tsld 260 for 5 Seconds
 

 


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Mr. Mr. Rony Qiu
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HongKong Double Light Electronics Technology Co. Ltd
7-G,Duhui 100 building,No.4 Zhonghang Road, Shenzhen, Guangdong, China (Mainland)
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