Description:
It is achieved in an environment of high temperature and superhigh pressure and thermally stable up to 1,200°C for its insert binder (mainly Si). Its SiC has a similar coefficient of thermal expansion to that of diamond & enjoys very good wear-resistance.
Application:
Different TSP products with different performances of wear-resistance, toughness, self-sharpening & high-temperature resistance can be used in gem-processing, wire drawing dies, coated cutters, etc. It can be applied on the drill bits for oilfields.
Quality Control:
1. Strict raw material selection to guarantee impurity below 20ppm; the binder's purity over 99.5%.
2. Advanced blending techniques to ensure thorough & even blending of diamond with binder.
3. Scientific formula & synthesis procedures. We can also adjust formula & procedures as per customers' requirements for the most suitable products.
4. Strict control of other auxiliary materials to guarantee precise dimensions & best quality.
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