Multilayer HDI PCB with immersion gold surface treatment

Trade Term: FOB
Payment Terms: T/T
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Basic Info.
  • Number of Layers: 8-Layer 
  • Brand Name: 3C-TECHNOLOGY 
  • Base Material: FR4 
  • Copper Thickness: 1oz 
  • Board Thickness: 1.6mm 
  • Min. Hole Size: 0.25mm 
  • Min. Line Width: 3mil 
  • Min. Line Spacing: 3mil 
  • Model No.: 3C-MHDI-07 
  • Place of Origin: Guangdong  
  • Min.Order: 10 Piece/Pieces
  • Means of Transport: Air
Supply Capacity
  • Production Capacity: 30000 square meters/month
  • Packing:Vacuum and carton for shipment
  • Delivery Date: 9-12 working days
  • Layer count: 8
  • Base material: FR4
  • Copper thickness: 1oz
  • Minimum hole size: 0.25mm
  • Minimum line width/space: 3mil/3mil
  • Solder mask: blue/10 to 30um
  • Surface treatment: immersion gold
  • Finished board thickness: 1.6mm
  • Panel array: four pieces in one panel
  • Copper thickness on PTH: 12.7um (minimum), 15um (average)
  • Application: Telecom

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Mr. Adam
Tel: 86-755-23086093
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Shenzhen 3c-technology Co.,Ltd
Rm.502,Xinbaosheng Bldg,233 Xixiang Rd, Shenzhen, Guangdong, China (Mainland)
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