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P/N:CM022-20060909
Material:FR-4 TG170
Size:160*120MM
Layer Coverage:8 Layers
Thickness:1.0mm
Surface Technique:Immersion Gold
Line Width/Space:5.9mils/5.9mils
Solder Mask Color: Green
Specialty:BGA, TG170 , two pairs of blind vias
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Ms. Winnie Hu (Sales Engineer)
Tel: 86-755-26054178
Mobile: 13760397193
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Contact Method
ABP ELECTRONICS LIMITED
10th Building,Zhongxing Industrial Zone,Chuangye Road, Nanshan District, Shenzhen, Guangdong, China (Mainland) / 518054
Fax: 86-755-26435488
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