Home > Electronic & Electrical > Agriculture/Garden Machinery > FR4 Through - Hole Gold Finger, Rosin Npth Electronic PCB Assembly With Surface - Mount

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FR4 Through - Hole Gold Finger, Rosin Npth Electronic PCB Assembly With Surface - Mount
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FR4 Through - Hole Gold Finger, Rosin Npth Electronic PCB Assembly With Surface - Mount

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FR4 Through - Hole Gold Finger, Rosin Npth Electronic PCB Assembly With Surface - Mount

 

Specifications:

Product Technical Parameter

Basic technology

Parameter

Single/Double sided

Multilayer

Number of Layers

1-2

4~16

Copper Thickness

0.25~3.0OZ

0.5~3.0OZ

Base Board Thickness

0.2~3.2mm

0.6~3.2mm

Incombustibility

94V-0

94V-0

Peelable resistance

12.3N/cm

12.3N/cm

Twist 

≤0.5%

≤0.5%

Insulation resistance

≥1011Ω

≥1011Ω

Test voltage

10-300V

10-300V

Finished board area

560×970mm

560×970mm

Min. Line Width and Spacing

0.1/0.1mm

0.1/0.1mm

Copper thickness in hole

≥25.0um

≥25.0um

Mini. pad diameter

Inner layer

0.05mm

Out layer

0.076mm

0.076mm

Mini. Hole Diameter

0.25mm

0.20mm

Hole tolerance

PTH

±0.076mm

±0.076mm

Send message to this supplier
Mr. Roger Li (Sales manager)
Tel: 86-755-82515447
Mobile: 86-13590449571
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Contact Method
US Industrial Co.,Ltd
3F,Building H,NO.10,East side Shangxue Industrial Park,Bantian Town, Longgang district, Shenzhen, Guangdong, China (Mainland) / 518129
Fax: 86-755-82518127
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