Main feature: fast speed and steady cutting with better smoothness and no damage to the edge, good chip removal......
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wafer segment diamond blades
wafer segment diamond blades
Payment Terms: | T/T,L/C,WU;PAYPAL |
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Basic Info.
- Place of Origin: Shanghai
- Means of Transport: EXPRESS, Ocean, Air, Land
Supply Capacity
- Production Capacity: 1000000
- Packing:boxes
- Delivery Date: one week
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