Customizedpcb
Peak technology(shenzhen) corporation limited is a professional PCB manufacturer, with thestrength of 1 - 12 layers of PCB and 1-6 layers of FPC production. Our businessare ranging from PCB & PCBA design and copy, to PCB manufacture.
Our pcb products arewidely used in communication apparatus, automobile electronics, computers,medical devices, light systems, outdoor systems, network devices and consumerelectronics class fields.
Welcome to send usyour inquiry.
We have 3 years gold supplierexperiences with alibaba.
We offer quick turnpcbs production for our customers:
1-2 layer in 48 hours,4 layer in 72 hours, 6 layer in 96 hours
Quotationrequired:
- Gerber file / PCB file
- Clear pictures of pcb/fpc/ pcba or pcba sample
- The PCB specification:base material, board thickness, copper thickness, surface finishing, goldimmersion thickness, and any other special requirements.
- Test method forPCB/PCBA
Delivery Time for Hi-frequency PCB
- 1)Sample within 6 days for high frequency board
- 2)Normal pcb within 4 days for sample
- 3) Quick turn PCBwithin 48 hours
MaximumProcess PCB Capability of Our Company
Item | ManufactureCapability | |
Material | FR-4 /Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metalbased | |
LayerNo. | 1-12 | |
FinishedBoard thickness | 0.2mm-3.8mm'(8 mil-150 mil) | |
BoardThickness Tolerance | ±10% | |
Cooperthickness | 0.5OZ-2OZ | |
CopperPlating Hole | 18-40um | |
ImpedanceControl | ±10% | |
Warp&Twist | 0.70% | |
Peelable | 0.012"(0.3mm)-0.02'(0.5mm) | |
Images | ||
Min TraceWidth (a) | 0.1mm (4mil) | |
Min SpaceWidth (b) | 0.1mm (4mil) | |
MinAnnular Ring | 0.1mm (4mil) | |
SMD Pitch(a) | 0.2 mm(8mil) | |
BGA Pitch(b) | 0.2 mm (8mil) | |
SolderMask | ||
MinSolder Mask Dam (a) | 0.0635 mm(2.5mil) | |
SoldermaskClearance (b) | 0.1mm (4mil) | |
Min SMTPad spacing (c) | 0.1mm (4mil) | |
SolderMask Thickness | 0.0007"(0.018mm) | |
Holes | ||
Min Holesize (CNC) | 0.2 mm (8mil) | |
Min PunchHole Size | 0.9 mm(35 mil) | |
Hole SizeTol (+/-) | PTH:±0.075mm;NPTH:±0.05mm | |
HolePosition Tol | ±0.075mm | |
Plating | ||
HASL | 2.5um | |
Lead freeHASL | 2.5um | |
ImmersionGold | Nickel3-7um Au:1-5u'' | |
OSP | 0.2-0.5um | |
Outline | ||
PanelOutline Tol (+/-) | CNC:±0.125mm, Punching: ±0.15mm | |
Beveling | 30°45° | |
GoldFinger angle | 15° 30°45° 60° | |
Certificate | ROHS,ISO9001:2008, SGS, UL certificate | |
Certificates
- UL
- ISO9001
- TS16949
- ISO14001
TestingItems
- 100%Electrical Test
- 100% VisualInspection (including warp & twist check)
- DimensionalInspection (finished hole sizes, pcb profiles, etc)
- Microsection
- Solderability Test (245±5ºC; 3-5 sec)
- Thermal Test (288±5ºC; 10 sec. inspect delamination,etc)
- Tape Test(adhesion test)
- Peel Test (conductor peel strength)
- ImpedanceTest
- Ionic ContaminationTest
