Laser beam transmitted by fiber which set on the top of solder ball exit. It set an entrance for high pressure gas on the top of circle cavity, the solder ball will be melted by laser beam, and then the high pressure inert gas will force the melted tin drop, it can also ensure that the melted tin will not be oxidized. This laser soldering system provides accurate and perfect soldering effects, which especially suitable for high precision soldering.
Product Features:
Precision droplet laser soldering applies for processing work piece needs high precision soldering, which is sensitive on the soldering temperature, and it is not appropriate for direct processing.
- It suitable for the solder ball with diameter from 50µm to 760µm.
- Swift heating and melting can be completed in 0.2s.
- Soldering is finished in soldering tip, without any splash.
- No soldering flux needed, without pollution, which maximize the lifetime of electronics.
- Solder ball can be as fine as 0.05mm, which is in accordance with the trend of electronics' miniaturization development.
- It can complete various soldering sports by choosing solder ball in different sizes.
- High qualified yields
Applications:
This equipment applies for soldering of wafer, photoelectron product, MEMS, sensor, BGA, HDD (HGA, HAS), as well as camera module.
This equipment applies for soldering of wafer, photoelectron product, MEMS, sensor, BGA, HDD (HGA, HAS), as well as camera module.
