Immersion Gold 6 Layer stack up PCB multi layered 35um copper

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Immersion Gold 6 Layer stack up PCB multi layered 35um copper

 

Specifications

 
1.High Power Immersion Gold 6 Layer PCB For Mobile Product
2.ROSH.ISO9001,SGS, UL
3.NO MOQ
4.Good quality
5.lower price


 
 
High Power Immersion Gold 6 Layer PCB For Mobile Product
 
 
-  HASL surface finish and 0.25mm hole size aluminum electronic board - PCB & PCBA Service
- Contact manufacturing
-  ROSH. ISO9001,SGS, UL Certificate
-  SMT&PCBA one-stop source
-  Competitive Price,High Quality, Good Service
 
 

1. Specification of PCB Manufacturing

 

1 Description PCB Specification
2 Material FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminum
3 Layer 1-20
4 Board Thickness 0.2mm- 4.0mm
5 Board Thickness Tolerance +/-10%
6 Copper thickness 17.5um-175um (0.5oz-5oz)
7 Min Trace Width 0.15mm
8 Min Space Width 0.15mm
9 Min Drilling Dia 0.2mm
10 PTH copper thickness 0.4-2mil(10-50um)
11 Tolerance of Etching ±1mil(±25um)
12 V-cut angle 25°,30°,45°,60°
13 Pearl Strength of line ≥ 6lb/in(≥ 107g/mm)
14 Impedance control and tolerance 50Ω±10%
15 Twist&Wrap ≤ 0.5%
16 Soldermask Green, Red, Blue, White, Black, Yellow
17 Surface Finish/Plating HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gold/ENIG
18 Certificate
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Shenzhen XingdaYun Technology Co., Ltd.
Floor 5 Area A Of Floor 3 Building A Area B Northern Yanchuan Industrial Zone, Songgang Town, Baoan Dist., Shenzhen, Guangdong, China (Mainland)
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