Multilayer 4 Layer OSP Lead Free PCB FR4 , TG135 / 1.6mm Board Thickness

Item

Capability 

1.Base Material

FR-4 / High TG FR-4 / Lead free Materials (ROHS Compliant) / 

Halogen Free material /CEM-3/CEM-1/ /PTFE/ROGERS/ARLON/TACONIC

2.Layers

1-30

3.Finised inner/outer copper thickness

1-12OZ

4.Finished board thickness

0.2-7.0mm

Tolerance

Board thickness≤1.0mm: +/-0.1mm

1<Board thickness≤2.0mm: +/-10%

Board thickness>2.0mm: +/-8%

5.Max panel size

≤2sidesPCB: 600*1500mm

Multilayer PCB: 500*1200mm

6.Min conductor line width/spacing

Inner layers: ≥3/3mil

Outer layers: ≥3.5/3.5mil

7.Min hole size

Mechanical hole: 0.15mm

Laser hole: 0.1mm

Drilling precision: first drilling

First drilling: 1mil

Second drilling: 4mil

8.Warpage

Board thickness≤0.79mm: β≤1.0%

0.80≤Board thickness≤2.4mm: β≤0.7%

Board thickness≥2.5mm: β≤0.5%

9.Controlled Impedance

+/-5%

10. Aspect Ratio

15:1

11.Min welding ring

4mil

12.Min solder mask bridge

≥0.08mm

13.Plugging vias capability

0.2-0.8mm

14. Hole tolerance

PTH: +/-3mil

NPTH: +/-2mil

15.Outline profile

Rout/ V-cut/ Bridge/ Stamp hole