Cutting Wire Rope for Solar Silicon 3550Mpa Intensity 37N - 43N Break Strength 0.12mm
Description:
The working principle of solar wafer linear cutting machine:machine’s guide wheel drives steel wire in high-speed running, so that the steel wire delivers the mortar mixed polythylene glycol with silicon carbide powder to cutting area:steel wire has continuous friction with work piece pressed on wire mesh in high speed running to complete the whole cutting process.
The cutting wire is produced by the company through dozens of line production processes.The cutting wire has reached world-class quality level and its advantage lies in small diameter and eliptical tolerance(finished diameter 0.10-0.25mm), various spool types and advanced winding technology to make the company deliver the best winding quality, small wire wear before and after cutting, low loss at wafer cutting.
| Specification(Φ) | Tolerances(±) | Intensity(MPa) | Break Strength |
| 0.12 | 0.002 | ≥3550N/mm2 | 37-43N |
