Alumina/SIC electronic porous ceramic plate for Vacuum Chuck/innovacera
New,refurbish,round,square or oval, 4",6",8" or 12" ,all can be provided.
fine-pore ceramic chuck tables and mainly used to support and chuck the semiconductor wafer when grinding and dicing .
it is applied in the processes of thinning ,dicing ,clearance, transportation and so on .these products which have high
cost performance produced by our institute can match with the machines made in Japan ,Germany ,Israel,
America and Chinawork piece processed :2,3,4,5,6,8,12 inches semiconductor wafer and we are 450mm ready!
suitable devices: wafer grinder, dicing machine and cleaning ,machine ,etcchuck type: fine-pore ceramic
Characteristics:
high flatness and parallelism
compact and uniform microstructure with high strength
good permeability and uniform adsorption affinity
dressing easily.
