Specification:
Item NO.PA COB MR16-5WPA COB MR16-7W
| Power (W) | 5W | 7W |
| Voltage(V) | 12V | 12V |
| Colour Temperature (K) | WW: 2700-3500k NW: 3500-5000K CW: 5000-7000K | WW: 2700-3500k NW: 3500-5000K CW: 5000-7000K |
| Light source | COB LED | COB LED |
| Colour Rendering Index(Ra) | Ra>80 | Ra>80 |
| Luminous flux(lm) | 350-400LM | 480-530lm |
| Beam angle | 38 degree | 38 degree |
| Material | Plastic-Aluminium body | Plastic-Aluminium body |
| Lifetime(Hrs) | 30,000Hrs | 30,000Hrs |
COB, (Chips on Board) , multi LED (light emitting diode) chips are packaged together as one lighting module. When it light up, it looks like a lighting panel. The greatest power densities on the smallest space are often the basis for unique selling points of various products on the market. These criteria can be realized by the COB technology (Chip On Board). Direct contacting of the semiconductors (LEDs) on PCBs allows for optimal thermal management, high packaging density and thus long-lasting and high-performance COB LED modules.
2. COB technology will allow the LED modules to be clusters on the circuit boards. Chips are protected and mounted directly on the circuit board. The LED dice from the wafer and places them by die and wire bonding processes directly on a printed circuit boards (PCB). A polymer layer is placed above the dice and wires for protection. Silicone is used as the polymer layer due to its low photo degradation.
3. Compare to traditional lighting such as fluorescent lamp, as it is super bright in a small size, it cause uncomfortable glare. In case of no diffused optical lens used, such LEDs usually cause glare and zebra strips . But when optical lens or cover used, it will cause light loss when LED beam pass through this lens or cover. While all the above disadvantages of traditional LED lighting can be overcome with the advent of COB LED lighting. COB LED is multi chips packaged, it can 10 times more increase lighting area, so it avoid uncomfortable glare by the maximum extent.
4. Thermal management requirements for high brightness LEDs require a very low thermal resistance system. This LED chip is processed by means of a special procedure which is called "Die Bonding". Here the individual chips are placed on the PCB and using the Wire Bonding method, connected to the contact surface of the PCB, which are described as "Pads". Gold wires in the micrometer range are used for contacting. The COB technology allows for virtually limitless freedom of scope for the PCBs and thus serves as the basis for totally unique LED solutions.
5. COB technology provides significant advantages over surface mount technology (SMT) components in the design with better temperature management, smaller size of lumen packages and lower production costs
