Custom Rigid Flex PCB , Rigid Flex Printed Circuit Boards
Specification
1. Material:FR4 +PI 0.2MM
2. Layer: 4 layer
3. Board Thickness: 1.2mm
4. Copper Thickness:0.75 OZ
5. Min. Line Width: 0.5mm
6. Min. space :0.5mm
7. Solder mask color :Green, Red, White, Yellow, Black, Blue
Detailed Specification of Flexible PCB Manufacturing
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Technical Specification |
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Layers: |
1~10 (flex Pcb) and 2~8 (rigid flex) |
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Min Panel Size: |
5mm x 8mm |
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Max Panel Size: |
250 x 520mm |
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Min Finished board thickness: |
0.05mm (1 sided inclusive copper) |
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Max Finished board thickness: |
0.3mm (2 sided inclusive copper) |
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Finished board thickness tolerance: |
±0.02~0.03mm |
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Material: |
Kapton, Polyimide, PET |
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Base copper thickness (RA or ED): |
1/3 oz, 1/2 oz, 1oz, 2oz |
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Base PI thickness: |
0.5mil, 0.7mil, 0.8mil, 1mil, 2mil |
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Stiffner: |
Polyimide, PET, FR4, SUS |
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Min Finished hole diameter: |
Φ 0.15mm |
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Max Finished hole diameter: |
Φ 6.30mm |
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Finished hole diameter tolerance (PTH): |
±2 mil ( ±0.050mm) |
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Finished hole diameter tolerance (NPTH): |
±1 mil ( ±0.025mm) |
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Min width/spacing (1/3oz): |
0.05mm/0.06mm |
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Min width/spacing (1/2oz): |
0.06mm/0.07mm |
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Min width/spacing (1oz): |
Single layer: 0.07mm/0.08mm |
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Double layer: 0.08mm/0.09mm |
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Aspect Ratio |
6:01 |
8:01 |
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Base Copper |
1/3Oz--2Oz |
3 Oz for Prototype |
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Size Tolerance |
Conductor Width:±10% |
W ≤0.5mm |
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Hole Size: ±0.05mm |
H ≤1.5mm |
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Hole Registration: ±0.050mm |
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Outline Tolerance:±0.075mm |
L ≤50mm |
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Surface Treatment |
ENIG: 0.025um - 3um |
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OSP: |
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Immersion Tin: 0.04-1.5um |
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Dielectric Strength |
AC500V |
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Solder Float |
288/10s |
IPC Standard |
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Peeling Strength |
1.0kgf/cm |
IPC-TM-650 |
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Flammability |
94V-O |
UL94 |
Quotation Requirement :
1) Following specifications are needed for quotation:
a) Base material
b) Board thickness:
c) Copper thickness
d) Surface treatment:
e) color of solder mask and silkscreen:
f) Quantity
Shiping method:
1) By DHL, Fedex, UPS, TNT etc.
2) By sea if it is possible
3) By air
