High Temperature Resistant Epoxy Resin Board for Laboratory
Size:3050*1550mm
Thickness:16/19/25mm
Epoxy resin plate, is epoxy resin, quartz sand, catalyst, curing agent and pigment mixed baked; does not contain any paper ingredients, effectively resist the moisture in the air, especially suitable for the operation of Taiwan splash zone, not easy to deformation, metamorphism; no delimitation, not swollen, no cracks and scratches can be polished to repair
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Application characteristics |
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strong adhesion force |
The polar hydroxyl and ether bonds inherent epoxy resin molecular chain in existence, which has high adhesion to various substances. Shrinkage of cured epoxy resin is low, the internal stress generated by small, it also helps to improve the adhesion strength |
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low shrinkage |
Compared with phenol resin, unsaturated polyester resin, a very low shrinkage sex shows during the curing process (less than 2%) |
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The Mechanical properties |
epoxy resin system cured with excellent mechanical properties |
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the electrical properties |
a kind of excellent insulating materials with high dielectric properties, resistance, and resistance to arc surface leakage |
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The chemical stability |
with excellent alkali resistance, acid resistance and solvent resistance |
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The Dimensional stability |
integrated many properties mentioned above, the epoxy resin system with dimensional stability and durability outstanding |
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Mold resistance |
epoxy resin systems were resistant to most fungi, can be used in harsh tropical conditions |
