OEM Single Sided PCB Flexible Printed Circuit Board Gold Plating Finish
A single sided flexible printed circuit (FPC)construction with a polyimide cover film laminated to copper allowing access from one side only. One single conductive layer, either bonded between two insulating lamination or uncovered on one side.
Our capability for FLEXIBLE PCB:
|
Item |
Description | Common | Special |
| 1 | NO. OF Layer | 1--6 | |
| 2 | FINISHED BOARD SIZE(MAX) | 250*500mm | OK |
| 3 | FINISHED BOARD SIZE(MIN) | 10*15mm | OK |
| 4 | BOARD THICKNESS(MAX) | 0.016"(0.4mm) | OK |
| 5 | BOARD THICKNESS(MIN) | 0.00328"(0.085) | OK |
| 6 | FINISHED BOARD THICKNESS FOLERANCE 0.085mmBoard Thickness0.4mm | ±2mil(±0.05mm) | OK |
| 7 | DRILL HOLE DIAMETER(MAX) | 0.236"(6.0mm) | OK |
| 8 | DRILL HOLE DIAMETER(MIN) | 0.010"(0.25mm) | OK |
| 9 | For Machine Drill FINISHED VIA DIAMETER(MIN) | 0.008"(0.2mm) | OK |
| 10 | OUTER LAYER BASE COPPER THICKNESS(MIN) | 1/2OZ(0.01778mm) | OK |
| 11 | OUTER LAYER BASE COPPER THICKNESS(MAX) | 1OZ(0.0355mm) | OK |
| 12 | INNER LAYER DIELECTRIC THICKNESS(MIN) | 0,0127mm(1/2mil) | OK |
| 13 | INNER LAYER DIELECTRIC THICKNESS(MAX) | 0.0254mm(1mil) | OK |
| 14 | BASE.MATERIAL | PI(260 TG) | OK |
| 15 | HOLE DIAMETER TOLERANCE(PTH) | ±2mil(±0.05mm) | ±1.5mil |
| 16 | HOLE DIAMETER TOLERANCE(NPTH) | ±1mil(±0.025mm) | ±1.5mil |
| 17 | HOLE POSITION TOLERANCE (COMPARED WITH CAD DATA) | ±3mil(±0.076mm) | OK |
| 18 | PTH HOLE COPPER THICKNESS | 0.5mil(0.0125mm) | OK |
| 19 | LAVER DESIGN LINE WIDTH/SPACING(MIN) | 4mil/4mil(0.1016mm/0.1016mm)Multilayer 2.5mil/2.5mil(0.0635mm/0.06 35mm)Double side,single layer 0.5OZ | OK |
| 20 | TOLERANCE AFTER ETCHING | ±20%(common) | ±10% for impedance |
| 21 | IMAGE TO IMAGE TOLERANCE(MIN) | ±5mil(±0.127mm) ±4mil | ±3mil(0.076mm) |
| 22 | IMAGE TO EDGE TOLERANCE(MIN) | ±4mil(±0.1mm) | OK |
| 23 | LEGEND MASK REGISTARTION(MIN) | ±6mil(±0.15mm) | OK |
| 24 | SOLDERMASK REGISTARTION(MIN) | ±6mil(±0.15mm) | OK |
| 25 | SOLDERMASK THICKNESS(MIN) | 10UM | OK |
| 26 | CVL REFISTRATION(MIN) | 8mil(4mil) | OK |
| 27 | CVLL Pressure and glue quantity (MIN) | 5.6mil(2.4mil) | OK |
| 28 | SOLDER TIN LEAD THICKNESS ON FINGER OR PAD.(MAX) (MIN)AND TOLEARANCE THICKNESS | (1.0mil)(0.1mil) ±0.30mil | ±0.15mil |
| 29 | GOLD FINGER NICKEL THICKNESS(MAX) | 200u"±100u" | OK |
| 30 | SOLDER THICKNESS ON PADS(HAL)(MIN) | 0.1mil | OK |
| 31 | NICKEL THICKNESS FOR ELECTROLESS NICKEL AND INMERSION GOLD(MEASLRED AT THE MINTMUM POINT)(MAX) | 200u"±50u"/1-4u" | OK |
| 32 | SOLDER THICKNESS ON PADS (HAL)(MAX) | 1.2mil | OK |
| 33 | SOLDERTHICKNESS ON PADS (HAL)(MIN) | 0.1mil | OK |
| 34 | PUNCHING HOLE (MIN-MAX)DIAMETER TOLERANCE | 0.5-6.0mm±0.05mm | OK |
| 35 | THE TOLERANCE OF PASTEING ADHESIVE AND STIFFER | ±0.20mm | ±0.10mil |
| 36 | PUNCHING DIE DIMENSION TOLERANCE (EDGE TO EDGE)(STEELDIE)Steel Die | ±4mil(±0.1mm) | ±2mil |
| 37 | PUNCHING DIE DIMENSION TOLERANCE (HOLE TO EDGE)(STEELDIE)Steel Die | ±4mil(±0.1mm) | ±2mil |
| 38 | PUNCHING DIE DIMENSION TOLERANCE (HOLE TO EDGE)(STEELDIE)cutting die | ±8mil(±0.2mm) |
±6mil |
