High Tg Rigid PCB Board with ENIG Finish Thick Gold , Printing Circuit Board
Key Specifications/Special Features
| Number. of Layers: | 6 |
| Laminate Material: | 170 Tg copper clad GFN Glass Expoxy Laminate Per IPC-4101 |
| Surface Finish: | 150 MICRO INCHES MINIMUM ELECTROLESS NICKEL (Ni) FOLLOWED BY 3-8 MICRO INCHES IMMERSION GOLD (Au) |
| Copper Thickness: | 1 oz copper for all alyers |
| Board Thickness: | 1.6 mm (0.062") |
| Board Size: | 12.50” X 7.00” |
| Color of Mask: | Blue |
| Color of Silkscreen: | White |
| Flammability: | UL 94V-0 |
| Workmanship: | Compliance with IPC-A-600 & IPC-6012 CLASS II |
| Thermal Conductivity | - |
Capacity
| High precision prototype | PCB bulk production | ||
| Max Layers | 1-28 layers | 1-14 layers | |
| MIN Line width(mil) | 3mil | 4mil | |
| MIN Line space(mil) | 3mil | 4mil | |
| Min via (mechanical drilling) | Board thickness≤1.2mm | 0.15mm | 0.2mm |
| Board thickness≤2.5mm | 0.2mm | 0.3mm | |
| Board thickness2.5mm | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
| Aspect Ration | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
| Board thickness | MAX | 8mm | 7mm |
| MIN | 2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm | 2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm | |
| MAX Board size | 610*1200mm | 610*1200mm | |
| Max copper thickness | 0.5-6oz | 0.5-6oz | |
|
Immersion Gold/ Gold Plated Thickness |
Immersion Gold:Au,1—8u” Gold finger:Au,1—150u” Gold Plated:Au,1—150u” Nickel Plated :50—500u” |
||
| Hole copper thick | 25um 1mil | 25um 1mil | |
| Tolerance | Board thickness | Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% |
Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% |
| Outline Tolerance | ≤100mm:+/-0.1mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm |
≤100mm:+/-0.13mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm |
|
| Impedance | ±10% | ±10% | |
| MIN Solder mask bridge | 0.08mm | 0.10mm | |
| Plugging Vias capability | 0.25mm--0.60mm | 0.70mm--1.00mm | |
High Tg PCB General Info
Tg means Glass Transition Temperature. As flammability of board is V-0 (UL 94-V0), so if the temperature exceeds designated Tg value, the board will changed from glassy state to rubbery state and then the function of board will be affected.
| If working temperature of your product is higher than normal (130-140C), then have to use high Tg material which is > 170C. Here are some popular High Tg board raw materials in market: |
S1170 & S1000-2: SYL (Shengyi Technology);
Also there're a lot of different hi-tg material not listed here, different country, different company prefer using different material. Please view datasheet for each of them to choose most suitable material for you. If without special notice, normally we will use S1170 from SYL.
170Tg is also popular in LED industry, because heat dissipation of LED is higher than normal electronic components, and same structure of FR4 board is much cheaper than that of MCPCB. If working temperature is higher than 170/180C, such as 200C, 280C, or even higher, then you'd better use Ceramic board which can go through -55~880C.
Please contact us for more information about High Tg circuit board.
