OEM Communication Copper Clad PCB With High Tg / FR-5 / ROGERS RoHs
Description:
- Best service with quick response is always provided for our customers.
- Certifications of ISO9001:2008,UL,CE,ROHS,REACH,HALOGEN-FREE is meet.
- Advanced production equipment imported from Japan and Germany,such as PCB Lamination Machine, CNC drilling machine,Auto-PTH line, AOI(Automatic Optic Inspection),Probe Flying Machine and so on.
- Quality guarantee and professional after-sale service.
- All kinds of surface finish is accepted,such as ENIG,OSP.Immersion Silver,Immersion Tin, Immersion Gold, Lead-free HASL,HAL.
- BGA,Blind&Buried Vias and Impedence Control is accepted.
- Gerber file needed.
PRODUCT’S DETAILS |
|
Raw Material |
FR-4 (Tg 180 available) |
Layer Count |
8-Layer |
Board Thickness |
1.6mm |
Copper Thickness |
2.0oz |
Surface Finish |
ENIG(Electroless Nickel Immersion Gold) |
Solder Mask |
Green |
Silkscreen |
White |
Min. Trace Width/Spacing |
0.075/0.075mm |
Min. Hole Size |
0.25mm |
Hole Wall Copper Thickness |
≥20μm |
Measurement |
300×400mm |
Packaging |
Inner: Vacuum-packed in soft plastic bales |
Application |
Communication,automobile,cell,computer,medical |
Advantage |
Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
Special Requirements |
Buried And Blind Via, Impedance Control, Via Plug, |
Certification |
UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
PRODUCTION CAPABILITY OF PCB |
||
Process Engineering |
Items |
Manufacturing Capability |
Laminate |
Thickness |
0.23.2mm |
Production Type |
Layer Count |
2L-16L |
Cut Lamination |
Max. Working Panel size |
1000×1200mm |
Inner Layer |
Internal Core Thickness |
0.12.0mm |
Internal width/spacing |
Min: 4/4mil |