Solderability Testing Device KH23
Product Attributes:
|
Product name |
Solderability Testing Device |
|
Brand Name |
ASIDA |
|
Model Number |
KH23 |
|
Place of Origin |
China |
|
Packaging Details |
Wooden Carton |
Solderability Testing Device KH23 JX22/JX23 Use:
This machine is used to test solderability and heat stress for PCB.
Solderability Testing Device KH23 Features:
1. Internal container is made by special material that conforms to the lead-free standards.
2. Patented design that adopts PID temperature adjustment unit to create stable,uniform and precise
temperatures.
3. Time adjustment and alarm functions
4. Conform to flexible PCB technical manual: GB/T 4677-2002;IPC-TM-650 2.4.12-1996IPC-TM-650 2.4.13-1998.
Solderability Testing Device KH23Parameters:
|
Item |
SPECIFICATION |
|
Model |
KH23 |
|
Internal dimension |
190×250×80(L×W×H) |
|
Shape diameter |
450×380×320(L×W×H) |
|
Control box dimension |
300×170×150(L×W×H) |
|
Volume of soldering tin |
1.902.53L ( Weight: 13.418.0kg) |
|
Temperature adjustment range |
~300 |
