Laser Cutting Machine for FPC / RF Accessories and Processing
Product Attributes:
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Product name |
UV Laser Cutting Machine |
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Brand Name |
ASIDA |
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Model Number |
JG18 |
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Certification |
CE |
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Place of Origin |
China |
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Packaging Details |
Wooden Carton |
UV Laser Cutting Machine USE:
The machine is used in cutting,opening the window and uncovery for CVL/FPC/RF and thin multilayer board,
as well as cutting a variety of substrates, such as ceramic, silicon etc.
UV Laser Cutting Machine CHARACTERISTICS:
1, Intellectual property rights to the control software. User friendly interface.
2. Processes any graphic, cuts multiple thicknesses and materials, stratified processing with complete
synchronicity.
3, High-performance, ultraviolet, short-wave laser light. High quality beam with higher peak power
properties. Ultraviolet light is decompressed,
vaporising instead of melting the cutting material resulting in vastly reduced burring. Small thermal effect,
no stratification, precise cutting effects, smooth, steep sidewall.
4, Fixed sample vacuum mode without using a matrix protection plate, convenient and efficient.
5, Used for a variety of substrate materials, such as: silicon, ceramics and glass.
6, Automatic correction, positioning and multiboard cutting functions. Automatic board thickness
measurement and compensation. Full stroke motor compensation function. Improved cutting
accuracy, reduced horizontal vibration. Improved depth cutting accuracy. Improved efficiency
in cutting complex patterns.
UV Laser Cutting Machine Client:
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Accuracy |
System processing accuracy:±20μm (ZHENGYE conditions) |
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Positioning accuracy:±3μm |
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Repeat accuracy:±1μm |
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Cutting speed |
≥150mm/s(ZHENGYE conditions) |
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Objects |
Cutting thickness:1.0mm |
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Maximum processing size:610X460mm or 610×500mm(Optional) |
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Dimensions |
1800*1600*1700mm |
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Weight |
2500Kg |
