FR4 Rigid HDI PCB High Frequency and High Density Interconnect PCB Circuit Board

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FR4 Rigid PCB High Quality HDI-001 High Frequency Circuit Boards

 

Specification:

 

Thickness

1.2mm

Model

XCER

Surface

ENIG

Origin

Shenzhen

Material

FR4

Packaging 

bubble bag 

Size

13*5cm

Brand

XCE

 

 

Quick detail:

 

Prodcction time:3-10 days

Shipping time:3-7 days according to express

 

 

Parameter

 

Through-hole resistance

<300Ωnormal

Electric strength

>1.3kv/mm

Current breakdown

10A

Peel strength

1.4N/mm

Soldmask regidity 

>6H

Thermal stress

28820Sec

Testing voltage

50-300V

Min buried blind via

0.2mm(8mil)

Outer copper thickness

1oz-5oz

Inner cooper thickness

1/2 oz-4oz

Min green oil open window

0.05mm

Insulation layer thickless

0.075mm-5mm

Taphole aperture

0.2mm-0.6mm

Special technology

Indepedance,Blind buried via,thick gold,aluminum PCB

Surface finish

Immersion Gold

 

 

Board thickness tolerance

T≥0.8mm±8%.,T<0.8mm±5%

Wall hole copper thickness

>0.025mm(1mil)

Finished hole

0.2mm-6.3mm

PTH aperture tolerance

±0.075mm(3mil)

NPTH aperture tolerance

±0.05mm(2mil)

Hole site deviation

±0.05mm(2mil)

Profile tolerance

±0.10mm(4mil)

Board bend&warp

≤0.7%

Insulation resistance

>1012Ωnormal

 

 

 

Advantage:

 

12 years pcb production experience

Full series high frequency pcb material raw

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Mr. KICO
Tel: 86-755-26055813
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Shenzhen Xinchenger Electronic Co.,Ltd
515B,BldA,Zhuhuichuangxin Center, Shenzhen, Guangdong, China (Mainland)
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