3D Printer Multi-Layer Rigid PCB Circuit Boards With Specialty Metal Core
Quick detail:
| Place of Origin:Guangdong, China (Mainland) |
| Brand Name: XCE |
| Model Number: XCER |
| Number of Layers: 6-Layer |
| Base Material: FR-4 |
| Copper Thickness: inner layers 1oz, outer layers 1.5oz |
| Board Thickness: 62mil |
| Surface Finishing: immersion gold |
Parameter:
| Layer No. | 1-26 | ||||||||
| Min board thickness | 2 layer 0.2mm | ||||||||
| 4 layer 0.4mm | |||||||||
| 6 layer 0.6mm | |||||||||
| 8 layer 0.8mm | |||||||||
| 10 layer 1.0mm | |||||||||
| Max panel size | 508*610mm | ||||||||
| Board thickness tolerance | T≥0.8mm±8%,T0.8mm±5% | ||||||||
| Wall hole copper thickness | 0.025mm(1mil) | ||||||||
| Finished hole | 0.2mm-6.3mm | ||||||||
| Min line width | 4mil/4mil(0.1/0.1mm) | ||||||||
| Min bonding pad space | 0.1mm(4mil) | ||||||||
| PTH aperture tolerance | ±0.075mm(3mil) | ||||||||
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PCB Capabilities By Market: |
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1. |
High Reliability PC Boards |
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-Up to 2000 Thermal cycles |
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2. |
Burn-in Boards |
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-6 Layers - .042" thick |
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-.5 mm pitch |
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-Step-down connectors |
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-Special materials |
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-Large sizes up to 24" x 28" |
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-High Reliability |
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3. |
High Technology Boards |
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-Microelectronics (Line and Space down to .00125"/.00125") |
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-Differential Impedance |
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-Up to 30 Layers |
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-Lead Free process |
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-Special materials |
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-Sequential lamination |
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-Blind and buried vias |
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-Laser Drill |
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-Filled vias |
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-Via in pads |
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-Milspec |
