Micro Circuit HDI Rogers Quick Turn PCB Single Side / Double Sided PCB Circuit Board

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Micro Circuit HDI Rogers PCB Within Quick Turn 24 Hours Service

 

Specification

  • Blind and/or buried vias
  • Via-in-pad
  • Through vias from surface to surface
  • 20 µm circuit geometries
  • 30 µm dielectric layers
  • 50 µm laser vias
  • 125 µm bump pitch processing

 

Description:

 

Model: XCER Layer: 4
Surface finish: immersion gold Board size:18*6cm
Board thickness: 0.8mm Special: buried blind hole

 

 

 

Parameter

 

Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance 1012Ωnormal
Through-hole resistance 300Ωnormal
Electric strength 1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity 6H
Thermal stress 28820Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
Special technology Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

 

 


Description:

 

Model Parameter thickness(mm) Permittivity(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO5880 0.254    0.508  0.762 2.20 ± 0.02
RO4350 0.254 0.508,0.8,1.524 3.5
RO4003 0.508 3.38
TACONIC TLF-35 0.8 3.5
TLA-6 0.254,0.8,1,1.5, 2.65
TLX-8 0.254,0.8,1,1.6 2.55
RF-60A 0.64 6.15
TLY-5 0.254,0.508,0.8 2.2
TLC-32 0.8,1.5,3 3.2
TLA-35 0.8 3.2
ARLON AD255C06099C 1.5 2.55
MCG0300CG 0.8 3.7
AD0300C 0.8 3
AD255C03099C 0.8 2.55
AD255C04099C 1 2.55
DLC220 1 2.2

 

 

 


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Shenzhen Xinchenger Electronic Co.,Ltd
515B,BldA,Zhuhuichuangxin Center, Shenzhen, Guangdong, China (Mainland)
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